Patent Assignment
Reel/Frame 044523/0838
Assignment of Assignor's Interest
Recorded: 2018-01-03
Pages: 4
Assignors
TANIGAWA, TAKAO
Executed: 2017-07-19
IRINO, TETSUROH
Executed: 2017-07-19
KONDOU, YUUSUKE
Executed: 2017-07-19
SHIMAYAMA, YUICHI
Executed: 2017-07-19
MIZUSHIMA, ETSUO
Executed: 2017-07-19
FUKUDA, TOMIO
Executed: 2017-07-19
NAGAI, YUKI
Executed: 2017-09-07
MURAI, HIKARI
Executed: 2017-09-13
Assignee
HITACHI CHEMICAL COMPANY, LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property
(1)
Resin Composition, Support with Resin Layer, Prepreg, Laminate, Multilayered Printed Wiring Board, and Printed Wiring Board for Millimeter-Wave Radar
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Jun 16, 2021
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 056598/0403 →
Change of Name
Mar 8, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062992/0805 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →