Resin composition, support with resin layer, prepreg, laminate, multilayered printed wiring board, and printed wiring board for millimeter-wave radar

1. A resin composition comprising:

a compound (A) having a maleimido group, a divalent group having at least two imido bonds, and a saturated or unsaturated divalent hydrocarbon group, the divalent hydrocarbon group not including a phenylene group, wherein the divalent group having at least two imido bonds is a group represented by the following formula (I):

wherein in the formula (I), R 1 represents a tetravalent organic group;

a maleimido group-containing compound (B) different from the compound (A), the maleimido group-containing compound (B) comprising an aromatic ring; and

an inorganic filler,

wherein the content of the compound (A) is 2% by mass or greater and 50% by mass or less based on the total mass of the resin composition, and

the content ratio of the inorganic filler is 5 to 70% by volume with respect to the total volume of the solid content in the resin composition.

2. The resin composition according to claim 1 , wherein the number of carbon atoms of the saturated or unsaturated divalent hydrocarbon group is 8 to 100.

3. The resin composition according to claim 1 , wherein the saturated or unsaturated divalent hydrocarbon group is a group represented by the following formula (II):

wherein in the formula (II), R 2 and R 3 each independently represent an alkylene group having 4 to 50 carbon atoms; R 4 represents an alkyl group having 4 to 50 carbon atoms; and R 5 represents an alkyl group having 2 to 50 carbon atoms.

4. The resin composition according to claim 1 , wherein the maleimido group-containing compound (B) has a structure having the maleimido group bonded to the aromatic ring.

5. The resin composition according to claim 1 , wherein the maleimido group-containing compound (B) is a compound represented by the following formula (VI):

wherein in the formula (VI), A 4 represents a residue represented by the following formula (VII), (VIII), (IX) or (X); and A 5 represents a residue represented by the following formula (XI):

wherein in the formula (VII), R 10 each independently represent a hydrogen atom, an aliphatic hydrocarbon group having 1 to 5 carbon atoms or a halogen atom,

wherein in the formula (VIII), R 11 and R 12 each independently represent a hydrogen atom, an aliphatic hydrocarbon group having 1 to 5 carbon atoms or a halogen atom; and A 6 represents an alkylene group or an alkylidene group having 1 to 5 carbon atoms, an ether group, a sulfide group, a sulfonyl group, a ketone group, a single bond or a residue represented by the following formula (VIII-1):

wherein in the formula (VIII-I), R 13 and R 14 each independently represent a hydrogen atom, an aliphatic hydrocarbon group having 1 to 5 carbon atoms or a halogen atom; and A 7 represents an alkylene group having 1 to 5 carbon atoms, an isopropylidene group, an ether group, a sulfide group, a sulfonyl group, a ketone group or a single bond,

wherein in the formula (IX), i is an integer of 1 to 10,

wherein in the formula (X), R 15 and R 16 each independently represent a hydrogen atom or an aliphatic hydrocarbon group having 1 to 5 carbon atoms; and j is an integer of 1 to 8,

wherein in the formula (XI), R 17 and R 18 each independently represent a hydrogen atom, an aliphatic hydrocarbon group having 1 to 5 carbon atoms, an alkoxy group having 1 to 5 carbon atoms, a hydroxyl group or a halogen atom; and A 8 represents an alkylene group or an alkylidene group having 1 to 5 carbon atoms, an ether group, a sulfide group, a sulfonyl group, a ketone group, a fluorenylene group, a single bond, a residue represented by the following formula (XI-1) or a residue represented by the following formula (XI-2):

wherein in the formula (XI-I), R 19 and R 20 each independently represent a hydrogen atom, an aliphatic hydrocarbon group having 1 to 5 carbon atoms or a halogen atom;

and A 9 represents an alkylene group having 1 to 5 carbon atoms, an isopropylidene group, a m-phenylenediisopropylidene group, a p-phenylenediisopropylidene group, an ether group, a sulfide group, a sulfonyl group, a ketone group or a single bond, and

wherein in the formula (XI-2), R 21 each independently represent a hydrogen atom, an aliphatic hydrocarbon group having 1 to 5 carbon atoms or a halogen atom; and A 10 and A 11 each independently represent an alkylene group having 1 to 5 carbon atoms, an isopropylidene group, an ether group, a sulfide group, a sulfonyl group, a ketone group or a single bond.

6. The resin composition according to claim 1 , wherein a relative dielectric constant at 10 GHz of a cured substance of the resin composition is 3.6 or lower.

7. A support with a resin layer comprising:

a resin layer comprising the resin composition according to claim 1 ; and

a support base material.

8. A prepreg comprising:

the resin composition according to claim 1 ; and

a fiber base material.

9. A laminate comprising:

a resin layer comprising a cured substance of the resin composition according to claim 1 ; and

a conductor layer.

10. A multilayered printed wiring board comprising:

a resin layer comprising a cured substance of the resin composition according to claim 1 ; and

at least three layers of circuit layers.

11. The multilayered printed wiring board according to claim 10 , wherein the number of the circuit layers is 3 to 20 layers.

12. A communication device comprising a multilayered printed wiring board for millimeter-wave radar, the multilayered printed wiring board comprising:

a resin layer comprising a cured substance of the resin composition according to claim 1 ; and

at least three layers of circuit layers.

13. The communication device according to claim 12 , wherein the communication device comprises a mobile communication device.

14. A printed wiring board for a millimeter-wave radar comprising:

a resin layer comprising a cured substance of the resin composition according to claim 1 ; and

a circuit layer.

15. The resin composition according to claim 1 , wherein the content of the compound (A) is 2% by mass or greater and 30% by mass or less based on the total mass of the resin composition.

16. A resin composition comprising:

a compound (A) having a maleimido group, a divalent group having at least two imido bonds, and a saturated or unsaturated divalent hydrocarbon group, the divalent hydrocarbon group not including a phenylene group, and the divalent hydrocarbon group being bonded between the maleimido group and the divalent group having at least two imido bonds;

a maleimido group-containing compound (B) different from the compound (A), the maleimido group-containing compound (B) comprising an aromatic ring; and

an inorganic filler,

wherein the content of the compound (A) is 2% by mass or greater and 50% by mass or less based on the total mass of the resin composition, and

the content ratio of the inorganic filler is 5 to 70% by volume with respect to the total volume of the solid content in the resin composition.

17. A support with a resin layer comprising:

a resin layer comprising the resin composition according to claim 16 ; and

a support base material.

18. A prepreg comprising:

the resin composition according to claim 16 ; and

a fiber base material.

19. A laminate comprising:

a resin layer comprising a cured substance of the resin composition according to claim 16 ; and

a conductor layer.

20. A multilayered printed wiring board comprising:

a resin layer comprising a cured substance of the resin composition according to claim 16 ; and

at least three layers of circuit layers.

21. A printed wiring board for a millimeter-wave radar comprising:

a resin layer comprising a cured substance of the resin composition according to claim 16 ; and

a circuit layer.

22. The resin composition according to claim 16 , wherein the content of the compound (A) is 2% by mass or greater and 30% by mass or less based on the total mass of the resin composition.