IP Library Granted Patent US 10,934,387
Granted Patent B2
US 10,934,387 · App. 15/539,974 · Granted Mar 2, 2021

Epoxy resin, epoxy resin composition, inorganic filler-containing epoxy resin composition, resin sheet, cured product, and epoxy compound

Inventors: Hideyuki Katagi (Tokyo, JP); Kenji Tanaka (Tokyo, JP); Yoshitaka Takezawa (Tokyo, JP); Haruaki Sue (Tokyo, JP); Shinichi Kosugi (Tokyo, JP)
Assignee: Showa Denko Materials Co., Ltd.
C08G59/24C08G59/245C08G59/62C08G59/621C08J5/18
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Quick Facts
Patent No.
US 10,934,387
App. No.
15/539,974
Granted
Mar 2, 2021
Kind
B2
Abstract

An epoxy resin obtained by a reaction of an epoxy resin monomer having a mesogen backbone and having two glycidyl groups in one molecule with a divalent phenol compound having, as substituents, two hydroxyl groups on one benzene ring, in which a number average molecular weight in gel permeation chromatographic measurement is from 600 to 2,500.

Claims (12)

1. An epoxy resin composition, comprising:

an epoxy resin, which is a reaction product of a first epoxy resin monomer having a mesogen backbone and having two glycidyl groups in a molecule thereof with hydroquinone, wherein the epoxy resin has a number average molecular weight in gel permeation chromatographic measurement of from 600 to 2,500; and

a second epoxy resin monomer having a mesogen backbone,

wherein the epoxy resin composition has a softening temperature measured by a ring-and-ball method of 100° C. or less,

wherein a total content of the first epoxy resin monomer and the second epoxy resin monomer in the epoxy resin composition is from 70 to 99% by mass, and

wherein the first epoxy resin monomer and the second epoxy resin monomer each comprises trans-4-{4-(2,3-epoxypropoxy)phenyl}cyclohexyl 4-(2,3-epoxypropoxy)benzoate.

2. An inorganic filler-containing epoxy resin composition, comprising:

the epoxy resin composition according to claim 1 ; and

an inorganic filler.

3. The inorganic filler-containing epoxy resin composition according to claim 2 , wherein a heat conductivity of a cured product thereof is 7 W/(m·K) or more.

4. The inorganic filler-containing epoxy resin composition according to claim 2 , wherein the inorganic filler comprises magnesium oxide.

5. The inorganic filler-containing epoxy resin composition according to claim 2 , wherein a content of the inorganic filler in the inorganic filler-containing epoxy resin composition is from 60% by volume to 90% by volume, with respect to the total volume of the inorganic filler-containing epoxy resin composition being 100% by volume.

Assignments (4)
CHANGE OF ADDRESS Recorded Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →
CHANGE OF NAME Recorded Mar 8, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062992/0805 →
CHANGE OF NAME Recorded Jan 26, 2021
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 055109/0600 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 3, 2018
From: KATAGI, HIDEYUKI; TANAKA, KENJI; TAKEZAWA, YOSHITAKA; SUE, HARUAKI; KOSUGI, SHINICHI
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 044522/0684 →
Priority Claims (1)
JP JP2014-266106 · Dec 26, 2014 · national
Continuity (1)
Related Publication 20170349695A1 · Dec 7, 2017