Patent Assignment
Reel/Frame 055109/0600
Change of Name
Recorded: 2021-01-26
Pages: 32
Assignor
HITACHI CHEMICAL COMPANY, LTD.
Executed: 2020-10-01
Assignee
SHOWA DENKO MATERIALS CO., LTD.
9-2, MARUNOUCHI I-CHOME, CHIYODA-KU, TOKYO, 20037-1164, JAPAN
Covered Property
(1)
Epoxy Resin, Epoxy Resin Composition, Inorganic Filler-Containing Epoxy Resin Composition, Resin Sheet, Cured Product, and Epoxy Compound
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jan 3, 2018
From: KATAGI, HIDEYUKI; TANAKA, KENJI; TAKEZAWA, YOSHITAKA; SUE, HARUAKI
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 044522/0684 →
Change of Name
Mar 8, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062992/0805 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →