IP Library Granted Patent US 10,957,964
Granted Patent B2
US 10,957,964 · App. 16/069,542 · Granted Mar 23, 2021

Multilayer transmission line plate

Inventors: Takao Tanigawa (Tokyo, JP); Tetsurou Irino (Tokyo, JP); Yuusuke Kondou (Tokyo, JP); Etsuo Mizushima (Tokyo, JP); Tomio Fukuda (Tokyo, JP); Yuki Nagai (Tokyo, JP)
Assignee: SHOWA DENKO MATERIALS CO., LTD.
H01P3/082C08G65/33396C08G73/121C08J5/24C08L79/08H01B7/08H01B11/00H01L23/12H01P11/003H05K1/0248H05K1/036H05K1/0366H05K3/4688C08J2379/08C08J2471/12H05K1/0346H05K2201/0191
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Quick Facts
Patent No.
US 10,957,964
App. No.
16/069,542
Granted
Mar 23, 2021
Kind
B2
Abstract

Provided is a multilayered transmission line plate including one pair of ground layers, a differential wiring layer disposed between one ground layer and the other ground layer of the one pair of ground layers, a first insulating portion disposed between the differential wiring layer and the one ground layer, and a second insulating portion disposed between the differential wiring layer and the other ground layer, wherein the first insulating portion has a resin layer, the first insulating portion or the second insulating portion has a fiber base material layer including a fiber base material, and a thickness of the first insulating portion is equal to or thinner than a thickness of the second insulating portion.

Claims (19)

1. A multilayered transmission line plate comprising:

one pair of ground layers,

a differential wiring layer disposed between one ground layer and the other ground layer of the one pair of ground layers,

a first insulating portion disposed between the differential wiring layer and the one ground layer, and

a second insulating portion disposed between the differential wiring layer and the other ground layer,

wherein the first insulating portion has a resin layer, the first insulating portion or the second insulating portion has a fiber base material layer containing a fiber base material, and a thickness of the first insulating portion is equal to or thinner than a thickness of the second insulating portion, and

wherein the resin layer includes (A) a maleimide group-containing compound containing (a1) a divalent group having at least two imide bonds and (a2) a saturated or unsaturated divalent hydrocarbon group.

2. The multilayered transmission line plate of claim 1 , comprising a first insulating layer ( 1 -I) as the first insulating portion and a second insulating layer ( 1 -II) as the second insulating portion, wherein the first insulating layer ( 1 -I) is the resin layer and the second insulating layer ( 1 -II) is the fiber base material layer.

3. The multilayered transmission line plate of claim 1 , comprising an insulating layer ( 2 -I) as the second insulating portion and a further insulating layer ( 2 -II) as the first insulating portion, wherein the further insulating layer ( 2 -II) includes two or more layers of a first insulating layer ( 2 -IIA) and a second insulating layer ( 2 -IIB) laminated on the first insulating layer ( 2 -IIA), the insulating layer ( 2 -I) is the fiber base material layer, the first insulating layer ( 2 -IIA) is the resin layer, and the second insulating layer ( 2 -IIB) is a further fiber base material layer.

4. The multilayered transmission line plate of claim 1 , wherein a dielectric constant of the fiber base material is 5.0 or less.

5. The multilayered transmission line plate of claim 1 , wherein (a2) the saturated or unsaturated divalent hydrocarbon group is a divalent aliphatic hydrocarbon group having 8 to 100 carbon atoms.

6. The multilayered transmission line plate of claim 1 , wherein (A) the maleimide group-containing compound is an N-aliphatic substituted maleimide group-containing compound.

7. The multilayered transmission line plate of claim 6 , wherein the resin layer further includes an N-aromatic substituted maleimide group-containing compound.

8. The multilayered transmission line plate of claim 1 , wherein the fiber base material layer is a layer including a fiber base material and a resin composition, and a difference in dielectric constant between the fiber base material and the resin composition is 1.0 or less.

9. A multilayered transmission line plate comprising:

one pair of ground layers,

a differential wiring layer disposed between one ground layer and the other ground layer of the one pair of ground layers,

an insulating layer ( 3 -I) disposed between the differential wiring layer and the one ground layer, no fiber base material layer being disposed between the differential wiring layer and the one ground layer, and

a further insulating layer ( 3 -II) disposed between the differential wiring layer and the other ground layer, wherein the further insulating layer ( 3 -II) has two or more layers of a first insulating layer ( 3 -IIA) and a second insulating layer ( 3 -IIB) laminated on the first insulating layer ( 3 -IIA), the insulating layer ( 3 -I) is a resin layer, the first insulating layer ( 3 -IIA) is a resin layer, and the second insulating layer ( 3 -IIB) is a fiber base material layer.

Assignments (4)
CHANGE OF ADDRESS Recorded Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →
CHANGE OF NAME Recorded Mar 8, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062992/0805 →
CHANGE OF NAME Recorded Jan 12, 2021
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 054962/0508 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 18, 2018
From: TANIGAWA, TAKAO; IRINO, TETSUROU; KONDOU, YUUSUKE; MIZUSHIMA, ETSUO; FUKUDA, TOMIO; NAGAI, YUKI
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 047220/0247 →