Method for producing semiconductor device
Disclosed is a method for producing a semiconductor device including a circuit board having a flexible resin layer that encapsulates a circuit component. The method may include a step of immersing a flexible substrate in an encapsulant, drying the encapsulant, and thereby encapsulating the circuit component with the encapsulant; and a step of curing the encapsulant, and thereby forming a flexible resin layer.
1. A method for producing a semiconductor device including a circuit board having a flexible substrate, a circuit component mounted on the flexible substrate, and a flexible resin layer encapsulating the circuit component,
the method comprising:
a step of laminating an encapsulant on the flexible substrate, and thereby encapsulating the circuit component with the encapsulant; and
a step of curing the encapsulant, and thereby forming the flexible resin layer,
wherein the recovery factor R of the flexible resin layer is 80% or higher, the recovery factor R is calculated by the formula R=Y/X, wherein X is the strain added to a measurement sample of the flexible resin layer during a first tensile test, and Y is the position at which load begins to be applied when the measurement sample is subsequently returned to the initial position and a second tensile test is performed.
2. The method according to claim 1 , further comprising a step of cutting the circuit board.
3. The method according to claim 1 , wherein the flexible resin layer includes at least one selected from the group consisting of a polyimide resin, an acrylic resin, a silicone resin, a urethane resin, an epoxy resin, and a polyethylene glycol resin.
4. The method according to claim 1 , wherein the flexible substrate and the flexible resin layer are transparent in the visible light region.
5. The method according to claim 1 , wherein the two or more kinds of the circuit components are provided.
6. A semiconductor device obtainable by the method according to claim 1 .