Printed wiring board and semiconductor package
Provided are a printed circuit board in which warps are effectively suppressed, and a semiconductor package having a semiconductor device mounted on said printed circuit board, even though circuit patterns of different amounts of metal are formed on both sides of one cured product of a prepreg. Specifically, said printed circuit board is a printed circuit board which comprises a cured product of a prepreg comprising a fiber base material and a resin composition, in which circuit patterns of different amounts of metal are formed on both sides of one cured product of the prepreg, in which said prepreg has layers on the front and back of said fiber base material, wherein said layers comprise resin compositions having different heat curing shrinkage rates, in which among these layers, the layer made of the resin composition having a smaller heat curing shrinkage rate is present on the side on which the circuit pattern with a smaller amount of metal is formed.
1. A printed circuit board comprising a cured product of a prepreg comprising a fiber base material and a resin composition, in which circuit patterns of different amounts of metal are formed on both sides of one cured product of the prepreg, respectively, in which
said prepreg has layers on the front and back of said fiber base material, wherein said layers comprise resin compositions having different heat curing shrinkage rates, in which among these layers, the layer made of the resin composition having a smaller heat curing shrinkage rate is present on the side on which the circuit pattern with a smaller amount of metal is formed, and wherein said prepreg satisfies a following formula (1) as well as a following formula (2):
0.12<{( a 1+ a 2)/2}/ B< 0.32 (1)
0.8 ≤a 1/ a 2≤1.25 (2)
wherein a 1 represents an average thickness of the resin composition after being cured which is present on one surface of the fiber base material; a 2 represents an average thickness of the resin composition after being cured which is present on other surface of the fiber base material; and B represents an average thickness of the fiber base material.
2. The printed circuit board according to claim 1 , wherein the layers comprising the resin compositions having different heat curing shrinkage rates on said each of the front and back of said fiber base material in said prepreg comprises different types of resin compositions.
3. The printed circuit board according to claim 1 , wherein the difference between the heat curing shrinkage rates of the resin compositions forming the layers on each of the front and back of said fiber base material is 0.3% or above.
4. The printed circuit board according to claim 1 , wherein the difference in the amount of metal between the circuit patterns on both sides is 15% by volume or above.
5. The printed circuit board according to claim 1 , wherein the thickness of the prepreg is 30 μm to 170 μm.
6. The printed circuit board according to claim 1 , wherein the stress generated by the difference in the amount of metal of one circuit pattern and the amount of metal of the other circuit pattern on said both sides is compensated by the stress generated by the difference in heat curing shrinkage rates of said resin compositions.
7. A semiconductor package comprising a semiconductor device mounted on the printed circuit board according to claim 1 .