Polyamideimide resin, resin composition, and semiconductor device
A polyamideimide resin containing a structural unit (Ia) represented by a formula shown below, and a structural unit (IIa) represented by a formula shown below. In the formula (Ia), each X independently represents a hydrogen atom, or at least one substituent selected from the group consisting of halogen atoms, alkyl groups of 1 to 9 carbon, atoms, and alkoxy groups and hydroxyalkyl groups of 1 to 9 carbon atoms. In the formula (IIa), each R independently represents a hydrogen atom, or at least one substituent selected from the group consisting of alkyl groups of 1 to 9 carbon atoms, alkoxy groups of 1 to 9 carbon atoms and halogen atoms, and n represents an integer of 1 to 6.
1. A polyamideimide resin containing a structural unit (Ia) represented by a formula shown below, and a structural unit (IIa) represented by a formula shown below, and a structural unit (IVa) represented by a formula shown below:
wherein in formula (Ia), each X independently represents a hydrogen atom, or at least one substituent selected from the group consisting of halogen atoms, alkyl groups of 1 to 9 carbon atoms, and alkoxy groups and hydroxyalkyl groups of 1 to 9 carbon atoms, and
in formula (IIa), each R independently represents a hydrogen atom or at least one substituent selected from the group consisting of alkyl groups of 1 to 9 carbon atoms, alkoxy groups of 1 to 9 carbon atoms and halogen atoms, and n represents an integer of 1 to 6.
2. The polyamideimide resin according to claim 1 , further containing a structural unit (IIIa) represented by a formula shown below:
wherein formula (IIIa), A represents an oxygen atom, a sulfur atom, one group selected from the group consisting of a carbonyl group, sulfonyl group, methylene group, dimethylmethylene group, hexafluoroisopropylidene group, amide group, ester group, diphenyl ketone group, 1,4-phenyleneoxy group, 1,4-biphenyleneoxy group, sulfonyl-bis(1,4-phenyleneoxy) group, isopropylidene-bis(1,4-phenyleneoxy) group and hexafluoroisopropylidene-bis(1,4-phenyleneoxy) group, or a single bond, and
each B independently represents a hydrogen atom, or at least one substituent selected from the group consisting of alkyl groups of 1 to 9 carbon atoms, alkoxy groups of 1 to 9 carbon atoms, a trifluoromethyl group, carboxylic acid groups, a hydroxy group, and halogen atoms.
3. A polyamideimide resin composition comprising the polyamideimide resin according to claim 1 , and a solvent.
4. The polyamideimide resin composition according to claim 3 , further comprising a coupling agent.
5. The polyamideimide resin composition according to claim 3 , which, when formed as a film, has an elastic modulus at 35° C. within a range from 0.5 GPa to 3.5 GPa.
6. A semiconductor device comprising a substrate, and a film formed using the polyamideimide resin composition according to claim 3 .
7. The semiconductor device according to claim 6 , further comprising a resin sealing layer.
8. The polyamideimide resin according to claim 1 , having a glass transition temperature of 300° C. or higher.