IP Library Granted Patent US 12,198,832
Granted Patent B2
US 12,198,832 · App. 17/612,138 · Granted Jan 14, 2025

Electrically-insulating resin composition and electrical insulator

Inventors: Tomoki Hirai (Tokyo, JP); Shiori Tabata (Tokyo, JP); Seiichi Shike (Tokyo, JP); Shuusuke Ishii (Tokyo, JP)
Assignee: Resonac Corporation
H01B3/306C08K3/36C08K5/521C08L79/08C08L2203/202
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Quick Facts
Patent No.
US 12,198,832
App. No.
17/612,138
Granted
Jan 14, 2025
Kind
B2
Abstract

An electrically-insulating resin composition comprising a polyamide-imide resin, a silica fine particle and a dispersant having a phosphate ester group. This electrically-insulating resin composition can be used to provide an electrical insulator having excellent withstand voltage life characteristics against a surge voltage.

Claims (16)

1. An electrically-insulating resin composition comprising a polyamide-imide resin, silica fine particles and a dispersant having a phosphate ester group, wherein an average primary particle size of the silica fine particles is 50 nm or less, and a blending amount of the silica fine particles with respect to 100 parts by mass of the of the polyamide-imide resin is 5 to 40 parts by mass.

2. The electrically-insulating resin composition according to claim 1 , wherein a blending amount of the dispersant having the phosphate ester group is 5 to 20 parts by mass per 100 parts by mass of the silica fine particles.

3. An electrical insulator comprising a conductor and an insulating film formed using the electrically-insulating resin composition according to claim 1 .

4. The electrical insulator according to claim 3 , wherein the conductor is a metal wire.

5. The electrically-insulating resin composition according to claim 1 , wherein an acid value of the dispersant having the phosphate ester group is in the range of 70 to 150 mgKOH/g.

6. The electrically-insulating resin composition according to claim 1 , wherein the average primary particle size of the silica fine particles is 40 nm or less.

7. The electrically-insulating resin composition according to claim 1 , wherein the average primary particle size of the fine particles is 30 nm or less.

8. The electrically-insulating resin composition according to claim 1 , wherein the average primary particle size of the silica fine particles is 20 nm or less.

9. The electrically-insulating resin composition according to claim 1 , wherein the average primary particle size of the silica fine particles is 3 nm or more.

10. The electrically-insulating resin composition according to claim 1 , wherein the average primary particle size of the silica fine particles is 5 nm or more.

11. The electrically-insulating resin composition according to claim 1 , wherein the average primary particle size of the silica fine particles is 10 nm or more.

12. The electrically-insulating resin composition according to claim 1 , wherein the average primary particle size of the silica fine particles is 10 to 20 nm.

13. The electrically-insulating resin composition according to claim 1 , wherein the average primary particle size of the silica fine particles is 10 to 15 nm.

14. The electrically-insulating resin composition according to claim 1 , wherein the average primary particle size of the silica fine particles is less than 50 nm.

15. The electrically-insulating resin composition according to claim 1 , wherein blending amount of the silica fine particles with respect to 100 parts by mass of the of the polyamide-imide resin is 10 to 40 parts by mass.

16. The electrically-insulating resin composition according to claim 1 , wherein blending amount of the silica fine particles with respect to 100 parts by mass of the of the polyamide-imide resin is 10 to 20 parts by mass.

Assignments (3)
CHANGE OF ADDRESS Recorded Feb 9, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066547/0677 →
CHANGE OF NAME Recorded Mar 8, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062992/0805 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 17, 2021
From: HIRAI, TOMOKI; TABATA, SHIORI; SHIKE, SEIICHI; ISHII, SHUUSUKE
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 058143/0054 →