IP Library Granted Patent US 11,778,776
Granted Patent B2
US 11,778,776 · App. 17/440,058 · Granted Oct 3, 2023

Cooling structure

Inventors: Hiroaki Shouda (Tagawa, JP); Takahiro Yamashita (Tagawa, JP); Kazutake Fujisawa (Tagawa, JP)
Assignee: RESONAC CORPORATION
H05K7/20263H05K7/20409H05K7/20927
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Quick Facts
Patent No.
US 11,778,776
App. No.
17/440,058
Granted
Oct 3, 2023
Kind
B2
Abstract

A cooling structure including a flow path configuration member made of resin and forming a flow path through which a refrigerant flows, a heat diffuser having a plate shape, including a metal, and being embedded in the flow path configuration member or joined to the flow path configuration member, and one or more cooling fins extending from the heat diffuser into the flow path and having a surface made of resin.

Claims (30)

1. A cooling structure, comprising:

a flow path configuration member made of resin and forming a flow path through which a refrigerant can flow;

a heat diffuser having a plate shape, including a metal, and being embedded in the flow path configuration member or joined to an outer wall of the flow path configuration member without being in contact with the flow path;

one or more cooling fins extending from the heat diffuser into the flow path and having a surface made of resin; and

a bus bar, which is cooled by transferring heat to the heat diffuser, fixed to a side of the heat diffuser opposite to a side of the heat diffuser on which the one or more cooling fins of the heat diffuser extend.

2. The cooling structure according to claim 1 , wherein the entirety of the one or more cooling fins is made of resin or the one or more cooling fins have a metal core material, a surface of which is covered with resin.

3. The cooling structure according to claim 1 , wherein the heat diffuser has a mesh shape or includes a punching metal.

4. The cooling structure according to claim 1 , wherein:

the metal configuring the heat diffuser is at least one selected from the group consisting of aluminum, iron, copper, gold, silver, and stainless steel, and

the resin configuring the one or more cooling fins is at least one selected from the group consisting of a polyphenylene sulfide-based resin, a polyimide-based resin, a polyphthalamide-based resin, a polybutylene terephthalate-based resin, a phenol-based resin, and an epoxy-based resin.

5. The cooling structure according to claim 1 , wherein the heat diffuser has a main surface facing the flow path.

6. The cooling structure according to claim 5 , wherein a ratio of a total sectional area of the one or more cooling fins extending from the heat diffuser into the flow path in a direction parallel to the main surface of the heat diffuser, to an area of the main surface of the heat diffuser, is 30% or more.

7. The cooling structure according to claim 1 , wherein a minimum distance h from a surface of the heat diffuser on a side of the flow path to an inner wall of the flow path configuration member is from 0.3 mm to 2.5 mm.

8. The cooling structure according to claim 1 , wherein the flow path configuration member has an outer wall that is at least partially provided with a metal layer.

9. The cooling structure according to claim 8 , wherein the metal layer includes a sprayed metal layer.

10. The cooling structure according to claim 2 , wherein the heat diffuser has a mesh shape or includes a punching metal.

11. The cooling structure according to claim 2 , wherein:

the metal configuring the heat diffuser is at least one selected from the group consisting of aluminum, iron, copper, gold, silver, and stainless steel, and

the resin configuring the one or more cooling fins is at least one selected from the group consisting of a polyphenylene sulfide-based resin, a polyimide-based resin, a polyphthalamide-based resin, a polybutylene terephthalate-based resin, a phenol-based resin, and an epoxy-based resin.

12. The cooling structure according to claim 3 , wherein:

the metal configuring the heat diffuser is at least one selected from the group consisting of aluminum, iron, copper, gold, silver, and stainless steel, and

the resin configuring the one or more cooling fins is at least one selected from the group consisting of a polyphenylene sulfide-based resin, a polyimide-based resin, a polyphthalamide-based resin, a polybutylene terephthalate-based resin, a phenol-based resin, and an epoxy-based resin.

13. The cooling structure according to claim 2 , wherein the heat diffuser has a main surface facing the flow path.

14. The cooling structure according to claim 3 , wherein the heat diffuser has a main surface facing the flow path.

15. The cooling structure according to claim 4 , wherein the heat diffuser has a main surface facing the flow path.

16. The cooling structure according to claim 13 , wherein a ratio of a total sectional area of the one or more cooling fins extending from the heat diffuser into the flow path in a direction parallel to the main surface of the heat diffuser, to an area of the main surface of the heat diffuser, is 30% or more.

17. The cooling structure according to claim 14 , wherein a ratio of a total sectional area of the one or more cooling fins extending from the heat diffuser into the flow path in a direction parallel to the main surface of the heat diffuser, to an area of the main surface of the heat diffuser, is 30% or more.

18. The cooling structure according to claim 15 , wherein a ratio of a total sectional area of the one or more cooling fins extending from the heat diffuser into the flow path in a direction parallel to the main surface of the heat diffuser, to an area of the main surface of the heat diffuser, is 30% or more.

19. The cooling structure according to claim 2 , wherein a minimum distance h from a surface of the heat diffuser on a side of the flow path to an inner wall of the flow path configuration member is from 0.3 mm to 2.5 mm.

20. The cooling structure according to claim 1 , wherein the bus bar is fixed to the side of the heat diffuser opposite to the side of the heat diffuser on which the one or more cooling fins of the heat diffuser extend by a bolt and a nut.

Assignments (3)
CHANGE OF ADDRESS Recorded Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →
CHANGE OF NAME Recorded Mar 8, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062992/0805 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 16, 2021
From: SHOUDA, HIROAKI; YAMASHITA, TAKAHIRO; FUJISAWA, KAZUTAKE
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 057505/0046 →
Priority Claims (1)
JP 2019-055694 · Mar 22, 2019 · national
Continuity (1)
Related Publication 20220192053A1 · Jun 16, 2022