IP Library Granted Patent US 11,745,482
Granted Patent B2
US 11,745,482 · App. 17/081,090 · Granted Sep 5, 2023

Fluororesin substrate laminate

Inventors: Kosuke Murai (Tokyo, JP); Takao Tanigawa (Tokyo, JP); Minoru Kakitani (Tokyo, JP); Makoto Yanagida (Tokyo, JP); Mami Shimada (Tokyo, JP)
Assignee: RESONAC CORPORATION
B32B27/322B32B7/12B32B15/085C09J7/241C09J7/30C09J139/04B32B2250/02B32B2250/03B32B2307/538B32B2457/08C09J2301/30C09J2427/006
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Quick Facts
Patent No.
US 11,745,482
App. No.
17/081,090
Granted
Sep 5, 2023
Kind
B2
Abstract

The present disclosure relates to a fluororesin substrate laminate for a high-frequency circuit, the fluororesin substrate laminate including a fluororesin substrate and an adhesive layer provided on the fluororesin substrate, wherein the adhesive layer includes a resin composition containing: (A) a maleimide compound having a saturated or unsaturated divalent hydrocarbon group; and (B) an aromatic maleimide compound.

Claims (22)

1. A fluororesin substrate laminate for a high-frequency circuit,

the fluororesin substrate laminate comprising a fluororesin substrate and an adhesive layer provided on the fluororesin substrate,

wherein the fluororesin substrate has

a dielectric loss tangent measured at a frequency of 10 GHz and a measurement temperature of 25° C. of 0.0010 to 0.0020, and

a coefficient of thermal expansion of 30 ppm/° C. or less in a direction of the fluororesin substrate,

wherein the fluororesin substrate has a thickness of 120 μm to 12700 μm, and

wherein the adhesive layer includes a resin composition containing: (A) a maleimide compound having a saturated or unsaturated divalent hydrocarbon group; and (B) an aromatic maleimide compound.

2. The fluororesin substrate laminate according to claim 1 , wherein the fluororesin substrate is a substrate including polytetrafluoroethylene.

3. The fluororesin substrate laminate according to claim 1 , wherein the (B) aromatic maleimide compound has a structure having a maleimide group bonded to an aromatic ring.

4. The fluororesin substrate laminate according to claim 1 , wherein the saturated or unsaturated divalent hydrocarbon group has 8 to 100 carbon atoms.

5. The fluororesin substrate laminate according to claim 1 , wherein the saturated or unsaturated divalent hydrocarbon group is a group represented by the following Formula (II):

wherein in Formula (II), R 2 and R 3 each independently represent an alkylene group having 4 to 50 carbon atoms; R 4 represents an alkyl group having 4 to 50 carbon atoms; and R 5 represents an alkyl group having 2 to 50 carbon atoms.

6. The fluororesin substrate laminate according to claim 1 , wherein the (A) maleimide compound having a saturated or unsaturated divalent hydrocarbon group further has a divalent group having at least two imide bonds.

7. The fluororesin substrate laminate according to claim 6 , wherein the divalent group having at least two imide bonds is a group represented by the following Formula (I):

wherein in Formula (I), R 1 represents a tetravalent organic group.

8. The fluororesin substrate laminate according to claim 1 , wherein the (A) maleimide compound having a saturated or unsaturated divalent hydrocarbon group has a weight average molecular weight of 500 to 10000.

9. The fluororesin substrate laminate according to claim 1 , further comprising a metal foil on the adhesive layer.

10. The fluororesin substrate laminate according to claim 9 , wherein the metal foil has a surface roughness of 0.05 to 2 μm.

11. The fluororesin substrate laminate according to claim 1 , wherein the resin composition further comprises a cyanate ester resin.

12. The fluororesin substrate laminate according to claim 1 , wherein the resin composition further comprises a styrene-ethylene-butylene copolymer modified with maleic anhydride.

13. The fluororesin substrate laminate according to claim 1 , wherein the fluororesin substrate has a dielectric loss tangent measured at a frequency of 10 GHz and a measurement temperature of 25° C. of 0.0010 to 0.0013.

14. The fluororesin substrate laminate according to claim 1 , wherein the fluororesin substrate has a dielectric constant measured at a frequency of 10 GHz and a measurement temperature of 25° C. of 2.2 to 3.5.

Assignments (3)
CHANGE OF ADDRESS Recorded Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →
CHANGE OF NAME Recorded Mar 8, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062992/0805 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 4, 2021
From: MURAI, KOSUKE; TANIGAWA, TAKAO; KAKITANI, MINORU; YANAGIDA, MAKOTO; SHIMADA, MAMI
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 054795/0107 →