Polyimide precursor, resin composition, insulated electric wire, and flexible substrate
Provided is a polyimide precursor including a polyimide precursor obtained by a reaction between a diamine compound and a tetracarboxylic dianhydride compound, in which the diamine compound contains at least one type selected from the group consisting of an aromatic diamine and an alicyclic diamine, the tetracarboxylic dianhydride compound contains at least one type selected from the group consisting of an aromatic tetracarboxylic dianhydride and an alicyclic tetracarboxylic dianhydride, and the total amount of the alicyclic diamine and the alicyclic tetracarboxylic dianhydride is 5.0 mol % or more and 70.0 mol % or less with respect to the total amount of constituent monomers of the polyimide precursor.
1 . A polyimide precursor, comprising: a polyimide precursor obtained by a reaction between a diamine compound and a tetracarboxylic dianhydride compound, wherein
the diamine compound contains an aromatic diamine and an alicyclic diamine, the alicyclic diamine containing at least one type selected from the group consisting of 4,4′-methylenebis(cyclohexylamine) and norbornane diamine,
an amount of the aromatic diamine is 40 mol % or more and 80.0 mol % or less with respect to a total amount of the diamine compound,
the tetracarboxylic dianhydride compound contains at least one type selected from the group consisting of an aromatic tetracarboxylic dianhydride and an alicyclic tetracarboxylic dianhydride, and
a total amount of the alicyclic diamine and the alicyclic tetracarboxylic dianhydride is 5.0 mol % or more and 30.0 mol % or less with respect to a total amount of constituent monomers of the polyimide precursor.
2 . The polyimide precursor according to claim 1 , wherein the amount of alicyclic diamine is 10.0 mol % or more and 60.0 mol % or less with respect to a total amount of the diamine compound.
3 . The polyimide precursor according to claim 1 , wherein the alicyclic diamine contains 4,4′-methylenebis(cyclohexylamine).
4 . The polyimide precursor according to claim 3 , wherein the tetracarboxylic dianhydride compound contains pyromellitic dianhydride.
5 . The polyimide precursor according to claim 4 , wherein the alicyclic diamine contains 4,4′-methylenebis(cyclohexylamine) in an amount of 5.0 mol % or more and 30.0 mol % or less with respect to a total amount of constituent monomers of the polyimide precursor.
6 . The polyimide precursor according to claim 5 , wherein the alicyclic diamine contains 4,4′-methylenebis(cyclohexylamine) in an amount of 10.0 mol % or more and 60.0 mol % or less with respect to a total amount of the diamine compound.
7 . The polyimide precursor according to claim 6 , wherein the polyimide precursor is used for an insulated electric wire.
8 . The polyimide precursor according to claim 1 , wherein the alicyclic diamine contains norbornane diamine.
9 . The polyimide precursor according to claim 1 , wherein the polyimide precursor is used for an insulated electric wire or is used for a flexible substrate.
10 . The polyimide precursor according to claim 1 , wherein the tetracarboxylic dianhydride compound contains pyromellitic dianhydride.
11 . An insulated electric wire, comprising: a conductor and a resin film that covers the conductor, wherein the resin film is a polyimide resin film obtained using the polyimide precursor according to claim 1 .
12 . A flexible, substrate: comprising a polyimide formed using the polyimide precursor according to claim 1 .
13 . A resin composition, comprising: the polyimide precursor according to claim 1 , and a solvent.
14 . A method for manufacturing an insulated electric wire, the method comprising: applying the resin composition according to claim 13 to a conductor and performing heating.
15 . A method for manufacturing a flexible substrate, the method comprising applying the resin composition according to claim 13 and performing heating.
16 . An insulated electric wire including a conductor and a resin film that covers the conductor, wherein the resin film is a polyimide resin film obtained using the polyimide precursor according to claim 6 .