IP Library Assignment 061193/0449
Patent Assignment
Reel/Frame 061193/0449

Assignment of Assignor's Interest

Recorded: 2022-09-23 Pages: 6
Assignors
MAENO, TOMOAKI
Executed: 2022-09-16
KAWABATA, YASUNORI
Executed: 2022-09-16
AOYAGI, SHOTA
Executed: 2022-09-16
YAMAUCHI, ARISA
Executed: 2022-09-16
Assignee
SHOWA DENKO MATERIALS CO., LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property (1)
Polyimide Precursor, Resin Composition, Insulated Electric Wire, and Flexible Substrate
Application: 17/908,973 →
Publication: US 2023/0116635
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Mar 8, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062992/0805 →
Change of Address Feb 9, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066547/0677 →