Patent Assignment
Reel/Frame 042773/0705
Assignment of Assignor's Interest
Recorded: 2017-06-21
Pages: 9
Assignors
KUSHIDA, KEISUKE
Executed: 2017-05-24
SHIMIZU, HIROSHI
Executed: 2017-05-24
KAKITANI, MINORU
Executed: 2017-05-24
SHIRAOKAWA, YOSHIKATSU
Executed: 2017-05-24
KANEKO, TATSUNORI
Executed: 2017-05-24
Assignee
HITACHI CHEMICAL COMPANY, LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property
(1)
Thermosetting Resin Composition and Its Production Method, Prepreg, Laminate, and Printed Wiring Board
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Aug 30, 2021
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 057351/0180 →
Change of Name
Mar 8, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062992/0805 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →