Patent Assignment
Reel/Frame 057351/0180
Change of Name
Recorded: 2021-08-30
Pages: 53
Assignor
HITACHI CHEMICAL COMPANY, LTD.
Executed: 2020-10-01
Assignee
SHOWA DENKO MATERIALS CO., LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property
(1)
Thermosetting Resin Composition and Its Production Method, Prepreg, Laminate, and Printed Wiring Board
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jun 21, 2017
From: KUSHIDA, KEISUKE; SHIMIZU, HIROSHI; KAKITANI, MINORU; SHIRAOKAWA, YOSHIKATSU
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 042773/0705 →
Change of Name
Mar 8, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062992/0805 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →