Adhesive film for circuit connection, and circuit connection structure and manufacturing method therefor
Disclosed is an adhesive film for circuit connection. This adhesive film for circuit connection includes a first adhesive layer containing conductive particles, a cured product of a photocurable resin component, and a first thermosetting resin component, and a second adhesive layer provided on the first adhesive layer and containing a second thermosetting resin component. A thickness of the first adhesive layer is 5 μm or less.
1 . An adhesive film for circuit connection, comprising:
a first adhesive layer comprising conductive particles, a cured product of a photocurable resin component comprising a radical polymerizable compound and a photo radical polymerization initiator, and a first thermosetting resin component comprising a cationic polymerizable compound and a thermal cationic polymerization initiator; and
a second adhesive layer provided on the first adhesive layer and comprising a second thermosetting resin component comprising a cationic polymerizable compound and a thermal cationic polymerization initiator, wherein
a thickness of the first adhesive layer is 5 μm or less,
the cationic polymerizable compound comprises both an oxetane compound and an alicyclic epoxy compound, and
in the first adhesive layer, a content of the cured product of the photocurable resin component is 10% to 30% by mass, and a content of the first thermosetting resin component is 20% to 40% by mass, based on a total mass of the first adhesive layer.
2 . The adhesive film for circuit connection according to claim 1 , wherein the thermal cationic polymerization initiator is a salt compound that has an anion comprising boron as a constituent element.
3 . The adhesive film for circuit connection according to claim 1 , further comprising a third adhesive layer provided on the first adhesive layer on a side opposite to the second adhesive layer and comprising a third thermosetting resin component.
4 . The adhesive film for circuit connection according to claim 3 , wherein the third thermosetting resin component comprises a cationic polymerizable compound and a thermal cationic polymerization initiator.
5 . The adhesive film for circuit connection according to claim 1 , wherein the radical polymerizable component is a bifunctional aromatic (meth)acrylate.
6 . A method for manufacturing a circuit connection structure, the method comprising interposing the adhesive film for circuit connection according to claim 1 between a first circuit member having a first electrode and a second circuit member having a second electrode and thermocompression bonding the first circuit member and the second circuit member to electrically connect the first electrode and the second electrode to each other.
7 . A circuit connection structure comprising:
a first circuit member having a first electrode;
a second circuit member having a second electrode; and
a circuit connection portion disposed between the first circuit member and the second circuit member and electrically connecting the first electrode and the second electrode to each other, wherein the circuit connection portion comprises a cured product of the adhesive film for circuit connection according to claim 1 .