IP Library › Assignment 063876/0676
Patent Assignment
Reel/Frame 063876/0676

Assignment of Assignor's Interest

Recorded: 2023-06-07 Pages: 4
Assignors
NAKAZAWA, TAKASHI
Executed: 2023-05-26
SAKAI, HIROYUKI
Executed: 2023-05-26
FUKUI, MASATO
Executed: 2023-05-26
NARITOMI, KAZUYA
Executed: 2023-05-26
YAMAZAKI, TOMOHARU
Executed: 2023-05-26
Assignee
SHOWA DENKO MATERIALS CO., LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property (1)
Adhesive Film for Circuit Connection, and Circuit Connection Structure and Manufacturing Method Therefor
Application: 17/926,362 →
Publication: US 2023/0234333
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Mar 8, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062992/0805 →
Change of Address Feb 9, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066547/0677 →