Slurry, method for producing polishing liquid, and polishing method
A slurry containing abrasive grains and a liquid medium, in which the abrasive grains include first particles and second particles in contact with the first particles, the first particles contain cerium oxide, the second particles contain a cerium compound, and in a case where a content of the abrasive grains is 2.0% by mass, a BET specific surface area of a solid phase obtained when the slurry is subjected to centrifugal separation for 30 minutes at a centrifugal acceleration of 1.1×10 4 G is 24 m 2 /g or more.
1. A slurry comprising abrasive grains and a liquid medium, wherein
the abrasive grains include first particles and second particles in contact with the first particles,
the first particles contain cerium oxide,
the second particles contain cerium hydroxide,
a particle size of the second particles is smaller than a particle size of the first particles, and
in a case where a content of the abrasive grains is 2.0% by mass, a BET specific surface area of a solid phase obtained when the slurry is subjected to centrifugal separation for 30 minutes at a centrifugal acceleration of 1.1×10 4 G is 24 m 2 /g or more.
2. The slurry according to claim 1 , wherein an average particle size of the abrasive grains is 16 to 1050 nm.
3. The slurry according to claim 1 , wherein a content of the abrasive grains is 0.01 to 10% by mass.
4. A method for producing a polishing liquid, the method comprising a step of filtering the slurry according to claim 1 .
5. A polishing method comprising a step of polishing a surface to be polished by using a polishing liquid obtained by the method for producing a polishing liquid according to claim 4 .
6. The polishing method according to claim 5 , wherein the surface to be polished contains silicon oxide.
7. The slurry according to claim 1 , wherein a particle size of the first particles is 100 nm or more.
8. The slurry according to claim 1 , wherein a particle size of the second particles is 30 nm or less.
9. The slurry according to claim 1 , wherein an average particle size of the abrasive grains is 120 nm or more.
10. The slurry according to claim 1 , wherein a content of cerium oxide in the abrasive grains is 50 to 97% by mass on the basis of all the abrasive grains in the slurry.
11. The slurry according to claim 1 , wherein a content of cerium hydroxide in the abrasive grains is 3 to 50% by mass on the basis of all the abrasive grains in the slurry.
12. The slurry according to claim 1 , wherein a content of the abrasive grains is 0.01 to 5% by mass.
13. A polishing liquid obtained by filtering the slurry according to claim 1 .
14. A slurry comprising abrasive grains and a liquid medium, wherein
the abrasive grains include first particles and second particles in contact with the first particles,
the first particles contain cerium oxide,
the second particles contain cerium hydroxide,
a particle size of the second particles is 30 nm or less, and
in a case where a content of the abrasive grains is 2.0% by mass, a BET specific surface area of a solid phase obtained when the slurry is subjected to centrifugal separation for 30 minutes at a centrifugal acceleration of 1.1×10 4 G is 24 m 2 /g or more.
15. The slurry according to claim 14 , wherein an average particle size of the abrasive grains is 16 to 1050 nm.
16. The slurry according to claim 14 , wherein a content of the abrasive grains is 0.01 to 10% by mass.
17. A method for producing a polishing liquid, the method comprising a step of filtering the slurry according to claim 14 .
18. A polishing method comprising a step of polishing a surface to be polished by using a polishing liquid obtained by the method for producing a polishing liquid according to claim 17 .
19. The polishing method according to claim 18 , wherein the surface to be polished contains silicon oxide.