IP Library Assignment 055613/0171
Patent Assignment
Reel/Frame 055613/0171

Assignment of Assignor's Interest

Recorded: 2021-03-16 Pages: 3
Assignors
HASEGAWA, TOMOYASU
Executed: 2021-03-02
IWANO, TOMOHIRO
Executed: 2021-03-02
MATSUMOTO, TAKAAKI
Executed: 2021-03-02
KUKITA, TOMOMI
Executed: 2021-03-10
Assignee
SHOWA DENKO MATERIALS CO., LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property (1)
Slurry, Method for Producing Polishing Liquid, and Polishing Method
Application: 17/262,143 →
Publication: US 2021/0246346
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Mar 8, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062992/0805 →
Change of Address Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →