IP Library Granted Patent US 12,378,376
Granted Patent B2
US 12,378,376 · App. 17/601,832 · Granted Aug 5, 2025

Optically softening resin composition, method for producing softened product of optically softening resin composition, curable resin composition and cured product of same, and patterned film and method for producing same

Inventors: Yuki Miyamoto (Tokyo, JP); Junichi Kamei (Tokyo, JP); Hiroshi Osaki (Tokyo, JP); Koichi Saito (Tokyo, JP); Takashi Kumaki (Tokyo, JP)
Assignee: RESONAC CORPORATION
C08J5/18C08G18/246C08G18/3876C08G18/7671C08G75/045C08K5/45C08K5/5397G03F7/038G03F7/039C08J2375/04C08K2201/014
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Quick Facts
Patent No.
US 12,378,376
App. No.
17/601,832
Granted
Aug 5, 2025
Kind
B2
Abstract

An optically softening resin composition contains a compound having a disulfide bond; and a radical scavenger. The compound having a disulfide bond may be a copolymer including a monomer unit having a disulfide bond and a functional group, and a monomer unit having a substituent reactive with the functional group. A curable resin composition contains a monomer having a disulfide bond and a functional group; a monomer having a substituent reactive with the functional group; and a radical scavenger.

Claims (16)

1. A patterned film having a pattern, the film comprising a cured product of a heat-curable resin composition, comprising:

a monomer having a disulfide bond and a functional group;

a monomer having a substituent reactive with the functional group;

a curing catalyst; and

a compound generating radicals by light irradiation.

2. The patterned film according to claim 1 , wherein the heat-curable resin composition is not cured by light irradiation.

3. The patterned film according to claim 1 , wherein the heat-curable resin composition further comprises a sensitizer.

4. A method for producing a patterned film, the method comprising:

patterning a cured product of a heat-curable resin composition by irradiating at least a part of the cured product of the heat-curable resin composition with light, the heat-curable resin composition comprising:

a monomer having a disulfide bond and a functional group;

a monomer having a substituent reactive with the functional group;

a curing catalyst; and

a compound generating radicals by light irradiation; and

developing the patterned cured product of the heat-curable resin composition.

5. The method according to claim 4 , wherein the cured product of the heat-curable resin composition has not been cured by light irradiation.

6. The method according to claim 4 , wherein the heat-curable resin composition further comprises a sensitizer.

Assignments (3)
CHANGE OF ADDRESS Recorded Feb 9, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066547/0677 →
CHANGE OF NAME Recorded Mar 8, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062992/0805 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 15, 2022
From: MIYAMOTO, YUKI; KAMEI, JUNICHI; OSAKI, HIROSHI; SAITO, KOICHI; KUMAKI, TAKASHI
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 059365/0643 →