Prepreg, laminate, printed wiring board, coreless substrate, semiconductor package and method for producing coreless substrate
The present invention relates to a prepreg including a fiber base material layer containing a fiber base material, a first resin layer formed on one surface of the fiber base material layer, and a second resin layer formed on the other surface of the fiber base material layer, wherein the first resin layer is a layer obtained through layer formation of a resin composition (I) containing, as a main component of resin components, an epoxy resin (A), and the second resin layer is a layer obtained through layer formation of a resin composition (II) containing, as a main component of resin components, an amine compound (B) having at least two primary amino groups in one molecule thereof and a maleimide compound (C) having at least two N-substituted maleimide groups in one molecule thereof; a laminated sheet obtained by using the prepreg; a printed wiring board; a coreless board; a semiconductor package; and a method of producing a coreless board.
1. A prepreg comprising a fiber base material layer containing a fiber base material, a first resin layer formed on one surface of the fiber base material layer, and a second resin layer formed on the other surface of the fiber base material layer, wherein the first resin layer is a layer obtained through layer formation of a resin composition (I) containing, as a main component of resin components, an epoxy resin (A), and the second resin layer is a layer obtained through layer formation of a resin composition (II) containing, as a main component of resin components, an amino-modified polyimide resin (X) that is a reaction product between an amine compound (B) having at least two primary amino groups in one molecule thereof and a maleimide compound (C) having at least two N-substituted maleimide groups in one molecule thereof, wherein the component (B) contains a siloxane compound having at least two primary amino groups in one molecule thereof.
2. The prepreg according to claim 1 , wherein the amino-modified polyimide resin (X) is a reaction product among an amine compound (B) having at least two primary amino groups in one molecule thereof, a maleimide compound (C) having at least two N-substituted maleimide groups in one molecule thereof, and an amine compound (D) having an acidic substituent represented by the following general formula (D-1):
wherein,
R D1 's each independently represent a hydroxy group, a carboxy group, or a sulfonic acid group, each of which is an acidic substituent; R D2 's each independently represent a hydrogen atom, an aliphatic hydrocarbon group having 1 to 5 carbon atoms, or a halogen atom; x is an integer of 1 to 5; y is an integer of 0 to 4; and a sum of x and y is 5.
3. The prepreg according to claim 1 , wherein the resin composition (II) further contains at least one thermosetting resin (G) selected from the group consisting of an epoxy resin and a cyanate resin.
4. The prepreg according to claim 1 , wherein at least one selected from the group consisting of the resin composition (I) and the resin composition (II) further contains an inorganic filler (E).
5. A laminated sheet obtained through lamination molding of the prepreg according to claim 1 .
6. A printed wiring board comprising the laminated sheet according to claim 5 .
7. A semiconductor package comprising a semiconductor device mounted on the printed wiring board according to claim 6 .
8. A coreless board comprising an insulating layer formed by using the prepreg according to claim 1 .
9. A method of producing a coreless board, comprising a step of disposing the prepreg according to claim 1 so as to come into contact with a circuit pattern.