Patent Assignment
Reel/Frame 050060/0614
Assignment of Assignor's Interest
Recorded: 2019-08-15
Pages: 10
Assignors
YOSHIDA, YUMA
Executed: 2019-05-16
SHIMAYAMA, YUICHI
Executed: 2019-05-16
NAKAMURA, YUKIO
Executed: 2019-05-16
TSUCHIKAWA, SHINJI
Executed: 2019-05-16
NAWATE, KATSUHIKO
Executed: 2019-05-16
HASHIMOTO, SHINTARO
Executed: 2019-05-24
Assignee
HITACHI CHEMICAL COMPANY, LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property
(1)
Prepreg, Laminate, Printed Wiring Board, Coreless Substrate, Semiconductor Package and Method for Producing Coreless Substrate
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Nov 22, 2021
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 058904/0764 →
Change of Name
Mar 8, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062992/0805 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →