Patent Assignment
Reel/Frame 058904/0764
Change of Name
Recorded: 2021-11-22
Pages: 53
Assignor
HITACHI CHEMICAL COMPANY, LTD.
Executed: 2020-10-01
Assignee
SHOWA DENKO MATERIALS CO., LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property
(1)
Prepreg, Laminate, Printed Wiring Board, Coreless Substrate, Semiconductor Package and Method for Producing Coreless Substrate
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Aug 15, 2019
From: YOSHIDA, YUMA; SHIMAYAMA, YUICHI; NAKAMURA, YUKIO; TSUCHIKAWA, SHINJI
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 050060/0614 →
Change of Name
Mar 8, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062992/0805 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →