Solder particle classifying method, solder particle, solder particle classifying system, adhesive composition, and adhesive film
A method for classifying solder particles includes: a first step of forming an electric field between a first electrode 2 and a second electrode 3 included in an electrostatic attraction device, the first electrode 2 having a disposition part having electrostatic diffusivity or electrical conductivity, the second electrode 3 having an attraction part 4 having electrical insulation properties, which faces the disposition part and is provided with a plurality of opening parts 10 opened to the disposition part side, so as to cause solder particles P disposed on the disposition part to be electrostatically attracted to the attraction part 4 ; a second step of removing solder particles P 2 attracted to areas other than the opening parts 10 of the attraction part 4 ; and a third step of collecting solder particles P 1 accommodated in the opening parts, from the attraction part 4 that has been subjected to the second step.
1. A method for classifying solder particles, the method comprising:
a first step of forming an electric field between a first electrode and a second electrode included in an electrostatic attraction device, the first electrode having a disposition part having electrostatic diffusivity or electrical conductivity, the second electrode having an attraction part having electrical insulation properties, which faces the disposition part and is provided with a plurality of opening parts opened to the disposition part side, so as to cause solder particles P disposed on the disposition part to be electrostatically attracted to the attraction part;
a second step of removing solder particles P 2 that are attracted to the attraction part and are not accommodated in the opening parts, from the attraction part; and
a third step of collecting solder particles P 1 accommodated in the opening parts, from the attraction part that has been subjected to the second step,
wherein the solder particles P have an average particle size of 10 μm or more.
2. The method for classifying solder particles according to claim 1 , wherein the solder particles P are such that a proportion of particles having a particle size of less than 10 μm is 30% by pieces or less.
3. The method for classifying solder particles according to claim 1 , wherein when an average particle size of the solder particles P is designated as MDp (μm), and an opening diameter of the opening parts is designated as OD (μm), MDp/OD satisfies 0.5 to 1.5.
4. Solder particles having an average particle size of 10 to 100 μm, a CV value of particle size of 3 to 15%, and an average degree of sphericity of 0.90 or more.
5. The solder particles according to claim 4 , wherein the average particle size is 10 to 50 μm.
6. An adhesive composition comprising an adhesive component and the solder particles according to claim 4 .
7. An adhesive film comprising an adhesive component and the solder particles according to claim 4 .
8. A solder particle classification system, comprising:
an electrostatic attraction device including a first electrode having a disposition part having electrostatic diffusivity or electrical conductivity, and a second electrode having an attraction part having electrical insulation properties, which faces the disposition part and is provided with a plurality of opening parts opened to the disposition part side;
a removing means for removing solder particles that are attracted to the attraction part and are not accommodated in the opening parts, from the attraction part; and
a collecting means for collecting solder particles accommodated in the opening parts of the attraction part.