Patent Assignment
Reel/Frame 070527/0819
Assignment of Assignor's Interest
Recorded: 2025-03-17
Pages: 4
Assignees
RESONAC CORPORATION
9-1, HIGASHI-SHIMBASHI 1-CHOME, MINATO-KU, TOKYO, 105-7325, JAPAN
SUGIMOTO, TOSHIYUKI
1244-50, KUBOTAMACHI KUBOTA, YONEZAWA-SHI, YAMAGATA, 992-0003, JAPAN
Covered Property
(1)
Solder Particle Classifying Method, Solder Particle, Solder Particle Classifying System, Adhesive Composition, and Adhesive Film
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.