Thermally conductive resin composition, cured product, heat transfer member and electronic device
A thermally conductive resin composition includes an epoxy resin and a thermally conductive powder. The thermally conductive powder includes aluminum nitride having a silicon-containing oxide coating on a surface thereof and another thermally conductive powder. The content of the epoxy resin is 1% by mass or more and 20% by mass or less based on the total amount of the thermally conductive resin composition. The content of the thermally conductive powder is 80% by mass or more and 99% by mass or less based on the total amount of the thermally conductive resin composition. The content of the aluminum nitride having a silicon-containing oxide coating on a surface thereof is 10% by mass or more and 70% by mass or less based on the total amount of the thermally conductive resin composition. The content of the other thermally conductive powder is 10% by mass or more and 89% by mass or less based on the total amount of the thermally conductive resin composition.
1 . A cured product of a thermally conductive resin composition comprising an epoxy resin and a thermally conductive powder, wherein
the thermally conductive powder comprises aluminum nitride having a silicon-containing oxide coating on a surface thereof and another thermally conductive powder,
a content of the epoxy resin is 1% by mass or more and 20% by mass or less based on the total amount of the thermally conductive resin composition,
a content of the thermally conductive powder is 80% by mass or more and 99% by mass or less based on the total amount of the thermally conductive resin composition, a content of the aluminum nitride having a silicon-containing oxide coating on a surface thereof is 10% by mass or more and 70% by mass or less based on the total amount of the thermally conductive resin composition, and a content of the other thermally conductive powder is 10% by mass or more and 89% by mass or less based on the total amount of the thermally conductive resin composition,
wherein the cured product has a thermal conductivity of 14 W/m·K or more, and has a rate of reduction in the thermal conductivity of less than 10% after 168 hours in a pressure cooker test at 120° C., 2 atm (0.2 MPa), and 100% relative humidity.
2 . The cured product according to claim 1 , wherein the aluminum nitride having a silicon-containing oxide coating on a surface thereof has a coverage of 70% or more and 100% or less as determined by low energy ion scattering spectroscopy.
3 . The cured product according to claim 1 , wherein the epoxy resin comprises at least one selected from the group consisting of a triphenylmethane-type epoxy resin and a bisphenol-type epoxy resin.
4 . The cured product according to claim 1 , wherein the other thermally conductive powder comprises a metal oxide.
5 . The cured product of claim 4 , wherein the metal oxide comprises alumina.
6 . The cured product according to claim 1 , which is for heat dissipation of a power module.
7 . A heat conducting member comprising the cured product according to claim 1 .
8 . The heat conducting member according to claim 7 , wherein the heat conducting member is for heat dissipation of a power module.
9 . An electronic device comprising the heat conducting member according to claim 7 and a heat dissipating member.