IP Library Granted Patent US 12,421,423
Granted Patent B2
US 12,421,423 · App. 17/757,384 · Granted Sep 23, 2025

Polishing method, machine device manufacturing method, and machine device

Inventors: Ryuji Monden (Tokyo, JP); Kunio Kondo (Tokyo, JP)
Assignee: MITSUBISHI CORPORATION
C09G1/02C09K3/1409
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Quick Facts
Patent No.
US 12,421,423
App. No.
17/757,384
Granted
Sep 23, 2025
Kind
B2
Abstract

One aspect of the present invention provides a polishing method including polishing a sliding part of a machine device by producing fullerene-aggregated particles by making the sliding part slide while a polishing-agent composition containing fullerenes and a solvent of the fullerenes is applied to the sliding part.

Claims (12)

1. A polishing method comprising polishing a sliding part of a machine device by producing fullerene-aggregated particles by making the sliding part slide while a polishing-agent composition containing fullerenes and a solvent of the fullerenes is applied to the sliding part,

wherein the solvent is mineral oil or chemically-synthesized oil, and

wherein a concentration of the fullerenes in the polishing-agent composition is adjusted such that, while the polishing is in progress, the fullerene-aggregated particles are produced when a surface roughness of the sliding part is greater than a target value and not produced when the surface roughness of the sliding part is less than or equal to the target value.

2. The polishing method according to claim 1 , wherein a concentration of the fullerenes in the polishing-agent composition is 1/50 to 1/1 of saturating solubility.

3. The polishing method according to claim 1 , wherein the polishing-agent composition contains the fullerene-aggregated particles only after the polishing is started.

4. The polishing method according to claim 1 , wherein the polishing is finished by diluting the polishing-agent composition applied to the sliding part, with a diluting solvent, and reducing the concentration of the fullerenes.

5. The polishing method according to claim 4 , wherein the diluting solvent is same as a solvent contained in the polishing-agent composition.

6. The polishing method according to claim 1 , wherein a material of the sliding part contains a resin.

7. The polishing method according to claim 1 , wherein the material of the sliding part contains a metal.

8. A polishing method comprising polishing a sliding part of a machine device by producing fullerene-aggregated particles by making the sliding part slide while a polishing-agent composition containing fullerenes and a solvent of the fullerenes is applied to the sliding part,

wherein the solvent is mineral oil or chemically-synthesized oil, and

wherein, after the polishing is started, the polishing is performed until the fullerene-aggregated particles are no longer produced in the polishing-agent composition.

Assignments (4)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 16, 2024
From: RESONAC CORPORATION
To: MITSUBISHI CORPORATION
Reel/Frame 067434/0947 →
CHANGE OF ADDRESS Recorded Feb 9, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066547/0677 →
DECLARATION OF SUCCESSION Recorded Mar 8, 2023
From: SHOWA DENKO K.K.
To: RESONAC CORPORATION
Reel/Frame 063011/0157 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 15, 2022
From: MONDEN, RYUJI; KONDO, KUNIO
To: SHOWA DENKO K.K.
Reel/Frame 060210/0250 →