Method for manufacturing semiconductor device by removing carrier after forming re-distribution layer
A method for manufacturing a semiconductor device includes preparing a temporary fixing structure body in which semiconductor elements each including a first surface on which a connection terminal is formed and a second surface are attached to a temporary fixing material, forming a curable bonding adhesive layer on the second surface of each of the semiconductor elements, attaching a carrier to one surface of the curable bonding adhesive layer opposite to the semiconductor elements, fixing the semiconductor elements to the carrier by curing the curable bonding adhesive layer, and removing the temporary fixing material. The semiconductor elements are attached onto the temporary fixing material such that the first surface of each of the semiconductor elements is directed toward the temporary fixing material, and are encapsulated with an encapsulant material such that the second surface of each of the semiconductor elements is exposed from an encapsulant material layer.
1 . A method for manufacturing a semiconductor device, comprising:
preparing a temporary fixing structure body in which a plurality of semiconductor elements each including a first surface on which a connection terminal is formed and a second surface on a side opposite to the first surface are attached to a temporary fixing material, in the temporary fixing structure body, the plurality of semiconductor elements being attached onto the temporary fixing material such that the first surface of each of the plurality of semiconductor elements is directed toward the temporary fixing material, and the plurality of semiconductor elements being encapsulated with an encapsulant material such that the second surface of each of the plurality of semiconductor elements is exposed from an encapsulant material layer,
forming a curable bonding adhesive layer on the second surface of each of the plurality of semiconductor elements;
attaching a carrier to one surface of the curable bonding adhesive layer on a side opposite to the plurality of semiconductor elements;
fixing the plurality of semiconductor elements to the carrier by curing the curable bonding adhesive layer through the cured curable bonding adhesive layer;
removing the temporary fixing material;
forming a re-distribution layer on the first surface of each of the plurality of semiconductor elements in a state in which the plurality of semiconductor elements are fixed to the carrier; and
removing the carrier after forming the re-distribution layer, wherein the carrier is removed from the cured curable bonding adhesive layer.
2 . The method for manufacturing a semiconductor device according to claim 1 ,
wherein the carrier is a glass substrate, and
wherein a bonding adhesive strength of the curable bonding adhesive layer to the glass substrate is 1 MPa or more when the curable bonding adhesive layer is cured, and is 5 MPa or less when the curable bonding adhesive layer is irradiated with laser.
3 . The method for manufacturing a semiconductor device according to claim 1 ,
wherein the curable bonding adhesive layer includes a resin composition containing a thermoplastic resin and an epoxy curing agent, and a glass transition temperature of the thermoplastic resin is −40° C. or higher and 40° C. or lower.
4 . The method for manufacturing a semiconductor device according to claim 1 ,
wherein a thickness of the curable bonding adhesive layer is 1 μm or more and 400 μm or less after curing.
5 . The method for manufacturing a semiconductor device according to claim 1 ,
wherein the carrier is a glass substrate or a transparent resin substrate, and a thickness thereof is 0.1 mm or more and 2.0 mm or less.
6 . The method for manufacturing a semiconductor device according to claim 1 , further comprising:
attaching a solder ball to the connection terminal of each of the plurality of semiconductor elements or the re-distribution layer in a state in which the plurality of semiconductor elements are fixed to the carrier.
7 . The method for manufacturing a semiconductor device according to claim 1 ,
wherein the carrier is a light transmissive substrate, and
wherein, in the removing of the carrier, the carrier is removed by irradiating the cured curable bonding adhesive layer with laser light from the carrier side.
8 . The method for manufacturing a semiconductor device according to claim 1 ,
wherein, in the removing of the carrier, the carrier is removed by applying laser light such that peeling energy for peeling off the carrier is 1 kW/cm 2 or more and 200 kW/cm 2 or less.
9 . The method for manufacturing a semiconductor device according to claim 1 ,
wherein, in the removing of the carrier, the carrier is removed by scraping or melting the carrier.
10 . The method for manufacturing a semiconductor device according to claim 1 , further comprising:
cleaning an exposed surface of either the cured curable bonding adhesive layer or the encapsulant material layer of the encapsulant material after the removing of the carrier.
11 . The method for manufacturing a semiconductor device according to claim 1 , further comprising:
singulating the plurality of semiconductor elements after the removing of the carrier.
12 . The method for manufacturing a semiconductor device according to claim 11 ,
wherein, in the singulating of the plurality of semiconductor elements, the cured curable bonding adhesive layer is singulated together with the plurality of semiconductor elements, and
wherein, the semiconductor device is acquired from each of the plurality of semiconductor elements in which the second surface is protected with the curable bonding adhesive layer.
13 . The method for manufacturing a semiconductor device according to claim 1 ,
wherein the preparing of the temporary fixing structure body includes;
preparing the temporary fixing material;
attaching the plurality of semiconductor elements to the temporary fixing material such that the first surface of each of the plurality of semiconductor elements is directed toward the temporary fixing material; and
encapsulating the plurality of semiconductor elements with the encapsulant material such that the second surface of each of the plurality of semiconductor elements attached to the temporary fixing material is exposed from the encapsulant material layer.
14 . The method for manufacturing a semiconductor device according to claim 1 ,
wherein, in the preparing of the temporary fixing structure body, the temporary fixing structure body in which a plurality of electronic components are attached to the temporary fixing material together with the plurality of semiconductor elements is prepared, and
wherein, in the fixing of the plurality of semiconductor elements, the plurality of electronic components are fixed to the carrier by curing the curable bonding adhesive layer.
15 . The method for manufacturing a semiconductor device according to claim 1 ,
wherein a bonding adhesive strength between the cured curable bonding adhesive layer and the encapsulant material is 4.0 MPa or more.
16 . The method for manufacturing a semiconductor device according to claim 1 ,
wherein the bonding adhesive strength between the cured curable bonding adhesive layer and the encapsulant material is 8.0 MPa or less.
17 . The method for manufacturing a semiconductor device according to claim 1 ,
wherein a bonding adhesive strength between the cured curable bonding adhesive layer and the encapsulant material is 20 MPa or more.
18 . The method for manufacturing a semiconductor device according to claim 1 ,
wherein a bonding adhesive strength between the cured curable bonding adhesive layer and the plurality of semiconductor elements is 4.0 MPa or more.
19 . The method for manufacturing a semiconductor device according to claim 1 ,
wherein the semiconductor device in a state in which the cured curable bonding adhesive layer protects the second surface of each of the plurality of semiconductor elements is acquired.