Patent Assignment
Reel/Frame 064067/0668
Assignment of Assignor's Interest
Recorded: 2023-06-27
Pages: 5
Assignors
MATSUBARA, HIROAKI
Executed: 2023-06-24
IKEDA, DAISUKE
Executed: 2023-06-07
OKAWARA, KEISUKE
Executed: 2023-06-06
SOBUE, SHOGO
Executed: 2023-06-06
OGAWA, SAEKO
Executed: 2023-06-06
Assignee
RESONAC CORPORATION
13-9, SHIBA DAIMON 1-CHOME, MINATO-KU, TOKYO, 105-8518, JAPAN
Covered Property
(1)
Method for Manufacturing Semiconductor Device by Removing Carrier After Forming Re-Distribution Layer
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.