Composition, method for cleaning adhesive polymer, method for producing device wafer, and method for regenerating support wafer

1. A composition comprising a quaternary alkylammonium fluoride or a hydrate thereof and an aprotic solvent, the aprotic solvent comprising

(A) an N-substituted amide compound having 4 or more carbon atoms and having no active hydrogen on a nitrogen atom, and

(B) an ether compound,

wherein the content of the aprotic solvent is 70 to 99.99% by mass.

2. The composition according to claim 1 , wherein the (A)N-substituted amide compound is a 2-pyrrolidone derivative compound represented by the formula (1):

wherein, in the formula (1), R 1 represents an alkyl group having 1 to 4 carbon atoms.

3. The composition according to claim 2 , wherein the (A)N-substituted amide compound is a 2-pyrrolidone derivative compound in which R 1 is a methyl group or an ethyl group in the formula (1).

4. The composition according to claim 1 , wherein the (B) ether compound has a flash point of 21° C. or higher.

5. The composition according to claim 1 , wherein the (B) ether compound comprises a dialkyl ether of glycol represented by the formula (2):

R 2 O(C n H 2n O) x R 3   (2),

wherein, in the formula (2), R 2 and R 3 each independently represent an alkyl group selected from the group consisting of a methyl group, an ethyl group, a propyl group, an isopropyl group, an n-butyl group, an isobutyl group, a sec-butyl group, and a t-butyl group, n is 2 or 3, and x is an integer of 1 to 4.

6. The composition according to claim 5 , wherein the dialkyl ether of glycol is diethylene glycol dimethyl ether or dipropylene glycol dimethyl ether.

7. The composition according to claim 5 , wherein the (B) ether compound further comprises a dialkyl ether represented by the formula (3):

R 4 OR 5   (3),

wherein, in the formula, R 4 and R 5 each independently represent an alkyl group having 4 to 8 carbon atoms.

8. The composition according to claim 1 , wherein the content of the (A) N-substituted amide compound is 15 to 85% by mass and the content of the (B) ether compound is 85 to 15% by mass, with respect to 100% by mass of the aprotic solvent.

9. The composition according to claim 1 , wherein the content of the quaternary alkylammonium fluoride is 0.01 to 10% by mass.

10. The composition according to claim 1 , wherein the quaternary alkylammonium fluoride is a tetraalkylammonium fluoride represented by R 6 R 7 R 8 R 9 N + F − , wherein R 6 to R 9 are each independently an alkyl group selected from the group consisting of a methyl group, an ethyl group, an n-propyl group, an isopropyl group, and an n-butyl group.

11. The composition according to claim 1 , which is a decomposing cleaning composition for an adhesive polymer.

12. The composition of claim 11 , wherein the adhesive polymer is a polyorganosiloxane compound.

13. A method for cleaning an adhesive polymer on a substrate by using the composition according to claim 1 .

14. A method for producing a device wafer comprising cleaning an adhesive polymer on a device wafer by using the composition according to claim 1 .

15. A method for regenerating a support wafer comprising cleaning an adhesive polymer on a support wafer by using the composition according to claim 1 .

16. The composition according to claim 1 , wherein the content of a protic solvent in the composition is 5% by mass or less.

17. The composition according to claim 1 , wherein the content of a protic solvent in the composition is 3% by mass or less.

18. The composition according to claim 1 , wherein the content of the aprotic solvent is 80 to 99.95% by mass.

19. The composition according to claim 1 , wherein the content of the aprotic solvent is 90 to 99.9% by mass.