Patent Assignment
Reel/Frame 055340/0001
Assignment of Assignor's Interest
Recorded: 2021-02-19
Pages: 2
Assignors
NAKAZAKI, SUSUMU
Executed: 2020-12-15
MIYAHARA, KUNIAKI
Executed: 2020-12-15
FUKUYO, TOMOYUKI
Executed: 2020-12-15
Assignee
SHOWA DENKO K.K.
13-9, SHIBA DAIMON 1-CHOME, MINATO-KU, TOKYO, 105-8518, JAPAN
Covered Property
(1)
Composition, Method for Cleaning Adhesive Polymer, Method for Producing Device Wafer, and Method for Regenerating Support Wafer
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.