Method for manufacturing electronic component device and electronic component device

1 . A method for manufacturing an electronic component device, comprising:

preparing a wiring structure comprising a wiring portion comprising a metal wiring and an insulating layer, the wiring portion having two main surfaces opposite to each other, and a connection portion provided on a mounting surface selected from one of the two main surfaces of the wiring portion;

fixing a plurality of conductor pins on the connection portion, wherein each of the plurality of conductor pins are formed as a metallic columnar-shaped body having a uniform width that is less than a length which extends perpendicular to the mounting surface of the wiring structure;

mounting one or more electronic components on the wiring structure; and

forming an encapsulation layer for encapsulating the one or more electronic components and the plurality of conductor pins on the wiring structure.

2 . The method according to claim 1 ,

wherein the one or more electronic components are arranged in a mounting region on the mounting surface of the wiring portion,

some or all of the plurality of conductor pins are spaced apart from each other so as to form one row that surrounds the mounting region, and

the encapsulation layer is filled between adjacent conductor pins in the one row.

3 . The method according to claim 2 , wherein the plurality of conductor pins additionally forms a second row that extends along an outer periphery of the mounting region and does not cross the one row.

4 . The method according to claim 3 , wherein conductor pins of the second row are offset from conductor pins of the one row that extend along the outer periphery of the mounting region, such that the plurality of conductor pins are arranged in a staggered arrangement.

5 . The method according to claim 2 , wherein a distance between the adjacent conductor pins in the one row is more than 50 μm and 250 μm or less.

6 . The method according to claim 1 , further comprising:

forming a conductive shield film that covers the encapsulation layer and is connected to a distal end of each of the plurality of conductor pins.

7 . The method according to claim 1 , further comprising:

exposing distal ends of the plurality of conductor pins by grinding the encapsulation layer from a surface opposite to the wiring structure.

8 . The method according to claim 1 , wherein the plurality of conductor pins are fixed on the wiring structure by:

arranging a mask having openings on the mounting surface side of the wiring structure; and

inserting the plurality of conductor pins through the openings in an upright position on the connection portion.

9 . The method according to claim 1 , wherein the plurality of conductor pins are fixed to the connection portion by melting a solder film covering an outer surface of the plurality of conductor pins along the length of the columnar-shaped body so that the solder film melts onto the connection portion, and electrically connects the plurality of conductor pins to the connection portion through the melted solder.

10 . The method according to claim 1 , wherein the columnar-shaped body of the plurality of conductor pins has a maximum width of 500 μm and a maximum length of 1000 μm.

11 . The method according to claim 1 , wherein the plurality of conductor pins are fixed on the wiring structure by:

arranging a mask having openings on the mounting surface of the wiring portion;

scattering the plurality of conductor pins on the mask; and

vibrating the wiring structure and the mask, thereby inserting the plurality of conductor pins through the openings.

12 . A method for manufacturing an electronic component device, comprising:

preparing a wiring structure including a wiring portion comprising a metal wiring and an insulating layer, the wiring portion having two main surfaces opposite to each other, and a connection portion provided on a mounting surface selected from one of the two main surfaces of the wiring portion; mounting one or more electronic components on the mounting surface of the wiring structure;

fixing a plurality of conductor pins on the connection portion; and

forming an encapsulation layer for encapsulating the one or more electronic components and the plurality of conductor pins on the wiring structure,

wherein a first set of the plurality of conductor pins are spaced apart from each other so as to form a first row of pins that surrounds the one or more electronic components,

a second set of the plurality of conductor pins are spaced apart from each other so as to form a second row of pins that surrounds the one or more electronic components without crossing the first row of pins, and

the second set of pins are offset from the first set of pins such that the plurality of conductor pins are arranged in a staggered arrangement around the one or more electronic components.

13 . The method according to claim 12 , wherein each of the plurality of conductor pins are formed as a columnar-shaped body having a width that is less than half of a length which extends perpendicular to the mounting surface of the wiring structure.