Patent Assignment
Reel/Frame 063011/0435
Assignment of Assignor's Interest
Recorded: 2023-03-17
Pages: 3
Assignee
RESONAC CORPORATION
13-9, SHIBA DAIMON 1-CHOME, MINATO-KU, TOKYO, 105-8518, JAPAN
Covered Property
(1)
Method for Manufacturing Electronic Component Device and Electronic Component Device
Application:
18/043,582 →
Publication:
US 2023/0268195
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.