Patent Assignment
Reel/Frame 049690/0600
Assignment of Assignor's Interest
Recorded: 2019-07-08
Pages: 17
Assignors
FUKADA, KEISUKE
Executed: 2019-06-26
ISHIBASHI, NAOTO
Executed: 2019-06-26
BANDO, AKIRA
Executed: 2019-06-26
ITO, MASAHIKO
Executed: 2019-06-26
KAMATA, ISAHO
Executed: 2019-06-26
TSUCHIDA, HIDEKAZU
Executed: 2019-06-26
HARA, KAZUKUNI
Executed: 2019-06-26
NAITO, MASAMI
Executed: 2019-06-26
UEHIGASHI, HIDEYUKI
Executed: 2019-06-26
FUJIBAYASHI, HIROAKI
Executed: 2019-06-26
AOKI, HIROFUMI
Executed: 2019-06-26
SUGIURA, TOSHIKAZU
Executed: 2019-06-26
SUZUKI, KATSUMI
Executed: 2019-06-26
Assignees
SHOWA DENKO K.K.
13-9, SHIBADAIMON 1-CHOME, MINATO-KU, TOKYO, 105-8518, JAPAN
CENTRAL RESEARCH INSTITUTE OF ELECTRIC POWER INDUSTRY
6-1, OTEMACHI 1-CHOME, CHIYODA-KU, TOKYO, 100-8126, JAPAN
DENSO CORPORATION
1-1, SHOWA-CHO, KARIYA-SHI, AICHI, 448-8661, JAPAN
Covered Property
(1)
SiC EPITAXIAL WAFER AND METHOD FOR PRODUCING SAME
Application:
16/476,412 →
Publication:
US 2019/0376206
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.