FILM ADHESIVE AND METHOD FOR MAKING SAME; DICING/DIE BONDING INTEGRATED FILM AND METHOD FOR MAKING SAME; AND SEMICONDUCTOR DEVICE AND METHOD FOR MAKING SAME

1 . A semiconductor device comprising:

a semiconductor chip;

a support member having the semiconductor chip mounted thereon; and

a bonding adhesive member provided between the semiconductor chip and the support member and adhering the semiconductor chip and the support member,

wherein the bonding adhesive member comprising a sintered body of silver particles.

2 . A method for manufacturing a film-shaped adhesive, the method comprising:

mixing a raw material varnish comprising silver particles and an organic solvent under temperature conditions of 50° C. or higher and preparing an adhesive varnish comprising the silver particles, the organic solvent, and a thermosetting resin component; and

forming the film-shaped adhesive by using the adhesive varnish.

3 . The method for manufacturing a film-shaped adhesive according to claim 2 , wherein the silver particles are silver particles manufactured by a reduction method.

4 . The method for manufacturing a film-shaped adhesive according to claim 2 , wherein the silver particles are silver particles that are surface-treated by using a surface treatment agent.

5 . The method for manufacturing a film-shaped adhesive according to claim 2 , wherein a content of the silver particles is 50% to 95% by mass based on a total solid content of the adhesive varnish.

6 . The method for manufacturing a film-shaped adhesive according to claim 2 , wherein the adhesive varnish further contains an elastomer.

7 . The method for manufacturing a film-shaped adhesive according to claim 2 , wherein the thermosetting resin component includes an epoxy resin and a phenol resin.

8 . A method for manufacturing a dicing-die bonding integrated film, the method comprising:

preparing the film-shaped adhesive obtainable by the method according to claim 2 , and a dicing tape comprising a base material layer and a pressure-sensitive adhesive layer provided on the base material layer; and

sticking together the film-shaped adhesive and the pressure-sensitive adhesive layer of the dicing tape to form a dicing-die bonding integrated film including the base material layer, the pressure-sensitive adhesive layer, and a bonding adhesive layer formed from the film-shaped adhesive, in this order.

9 . A method for manufacturing a semiconductor device, the method comprising:

sticking a semiconductor wafer to the bonding adhesive layer of the dicing-die bonding integrated film obtainable by the method according to claim 8 ;

producing a plurality of singulated adhesive piece-attached semiconductor chips by dicing the semiconductor wafer with the bonding adhesive layer stuck thereto;

adhering the adhesive piece-attached semiconductor chips on a support member, with the adhesive piece interposed therebetween; and

thermally curing the adhesive piece in the adhesive piece-attached semiconductor chip adhered to the support member.

10 . A film-shaped adhesive comprising a sintered body of silver particles in a cured product obtainable when the film-shaped adhesive is thermally cured under conditions of 170° C. and 3 hours.

11 . The film-shaped adhesive according to claim 10 , wherein the cured product obtainable when the film-shaped adhesive is thermally cured under conditions of 170° C. and 3 hours has a thermal conductivity of 5.0 W/m·K or higher.

12 . The film-shaped adhesive according to claim 10 , wherein a content of the silver particles is 50% to 95% by mass based on a total amount of the film-shaped adhesive.

13 . A dicing-die bonding integrated film comprising a base material layer, a pressure-sensitive adhesive layer, and a bonding adhesive layer formed from the film-shaped adhesive according to claim 10 .