Patent Assignment
Reel/Frame 064209/0864
Assignment of Assignor's Interest
Recorded: 2023-07-11
Pages: 10
Assignors
AKIYAMA, YUYA
Executed: 2023-06-14
TANIGUCHI, KOHEI
Executed: 2023-06-20
HIRAMOTO, YUYA
Executed: 2023-06-19
KAMONO, MEGUMI
Executed: 2023-06-20
ITAGAKI, KEI
Executed: 2023-06-08
Assignee
RESONAC CORPORATION
13-9, SHIBA DAIMON 1-CHOME, MINATO-KU, TOKYO, 105-8518, JAPAN
Covered Property
(1)
Film Adhesive and Method for Making Same; Dicing/Die Bonding Integrated Film and Method for Making Same; and Semiconductor Device and Method for Making Same
Application:
18/258,846 →
Publication:
US 2023/0395420
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.