PRIMER, SUBSTRATE EQUIPPED WITH PRIMER LAYER, METHOD FOR PRODUCING SUBSTRATE EQUIPPED WITH PRIMER LAYER, SEMICONDUCTOR DEVICE, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
A primer for forming a primer layer on the surface of a substrate having surface free energy of 50 mN/m or higher, the primer including a liquid crystalline epoxy compound and a curing agent.
1 . A primer for forming a primer layer on a surface of a substrate having a surface free energy of 50 mN/m or higher, the primer comprising:
a liquid crystalline epoxy compound; and
a curing agent.
2 . The primer according to claim 1 ,
wherein the liquid crystalline epoxy compound comprises at least one of a structure represented by the following general formula (M-1) and a structure represented by the following general formula (M-2),
in the general formula (M-1) and the general formula (M-2), Y's each independently represent an aliphatic hydrocarbon group having 1 to 8 carbon atoms, an alkoxy group having 1 to 8 carbon atoms, a fluorine atom, a chlorine atom, a bromine atom, an iodine atom, a cyano group, a nitro group or an acetyl group, n's each independently represent an integer of 0 to 4, and * represents a bonding site to an adjacent atom.
3 . The primer according to claim 2 ,
wherein the crystalline epoxy compound comprises a reaction product between a liquid crystalline epoxy compound comprising at least one of the structure represented by the general formula (M-1) and the structure represented by the general formula (M-2) and at least one selected from the group consisting of hydroquinone, 3,3-biphenol, 4,4-biphenol, 2,6-naphthalenediol, 1,5-naphthalenediol, 4-hydroxybenzoic acid and 2-hydroxy-6-naphthoic acid.
4 . The primer according to claim 1 ,
wherein the curing agent comprises at least one selected from the group consisting of an amine-based curing agent and a phenolic curing agent.
5 . The primer according to claim 1 ,
wherein a liquid crystalline structure that is formed by a reaction between the liquid crystalline epoxy compound and the curing agent is a nematic structure or a smectic structure.
6 . The primer according to claim 5 ,
wherein the smectic structure has a periodic structure in which a length of one period is 2 nm to 4 nm.
7 . The primer according to claim 1 , further comprising:
an alcohols solvent.
8 . The primer according to claim 1 ,
wherein the substrate is a metal substrate.
9 . A substrate equipped with a primer layer comprising:
a substrate; and
a primer layer,
wherein the primer layer is a cured product of the primer according to claim 1 , and
a surface free energy of a surface of the substrate facing the primer layer is 50 mN/m or higher.
10 . A method for producing a substrate equipped with a primer layer, the method comprising:
a step of forming a layer comprising the primer according to claim 1 on a substrate; and
a step of forming a primer layer by curing the layer comprising the primer,
wherein a surface free energy of a surface of the substrate facing the primer layer is 50 mN/m or higher.
11 . A semiconductor device comprising:
a substrate;
a primer layer; and
an insulating member in this order,
wherein the primer layer is a cured product of the primer according to claim 1 , and
a surface free energy of a surface of the substrate facing the primer layer is 50 mN/m or higher.
12 . A method for producing a semiconductor, the method comprising:
a step of forming a layer comprising the primer according to claim 1 , on a substrate;
a step of disposing an insulating member on the layer comprising the primer, and
a step of forming a primer layer by curing the layer comprising the primer,
wherein a surface free energy of a surface of the substrate facing the primer layer is 50 mN/m or higher.
13 . The primer according to claim 2 ,
wherein the curing agent comprises at least one selected from the group consisting of an amine-based curing agent and a phenolic curing agent.
14 . The primer according to claim 3 ,
wherein the curing agent comprises at least one selected from the group consisting of an amine-based curing agent and a phenolic curing agent.
15 . The primer according to claim 2 ,
wherein a liquid crystalline structure that is formed by a reaction between the liquid crystalline epoxy compound and the curing agent is a nematic structure or a smectic structure.
16 . The primer according to claim 3 ,
wherein a liquid crystalline structure that is formed by a reaction between the liquid crystalline epoxy compound and the curing agent is a nematic structure or a smectic structure.
17 . The primer according to claim 4 ,
wherein a liquid crystalline structure that is formed by a reaction between the liquid crystalline epoxy compound and the curing agent is a nematic structure or a smectic structure.
18 . The primer according to claim 2 , further comprising:
an alcohols solvent.
19 . The primer according to claim 3 , further comprising:
an alcohols solvent.
20 . The primer according to claim 4 , further comprising:
an alcohols solvent.