Patent Assignment
Reel/Frame 061965/0520
Assignment of Assignor's Interest
Recorded: 2022-12-05
Pages: 8
Assignors
TANG, NING
Executed: 2022-11-01
TANAKA, SHINGO
Executed: 2022-11-22
TAKEZAWA, YOSHITAKA
Executed: 2022-11-11
Assignee
SHOWA DENKO MATERIALS CO., LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU,, TOKYO, 100-6606, JAPAN
Covered Property
(1)
Primer, Substrate Equipped with Primer Layer, Method for Producing Substrate Equipped with Primer Layer, Semiconductor Device, and Method for Producing Semiconductor Device
Application:
17/925,014 →
Publication:
US 2023/0183415
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.