Patent Assignment
Reel/Frame 063410/0085
Change of Name
Recorded: 2023-04-23
Pages: 11
Assignor
SHOWA DENKO MATERIALS CO., LTD.
Executed: 2023-01-01
Assignee
RESONAC CORPORATION
13-9, SHIBA DAIMON 1-CHOME, MINATO-KU,, TOKYO,, JAPAN
Covered Properties
(19)
Resin Composition for Molding and Electronic Component Apparatus
Application:
17/791,534 →
Publication:
US US20230092703A1
Encapsulating Material for Compression Molding and Electronic Part Device
Compound, Molded Article, and Cured Product
Coating Liquid, Composite Material, and Coating Film
Curable Composition, Heat Storage Material, and Article
Application:
17/437,412 →
Publication:
US US20220162491A1
Anisotropic Heat-Conducting Resin Member and Heat-Transmitting Substrate
Application:
17/422,440 →
Publication:
US US20220089930A1
Method for Producing Bonded Object and Semiconductor Device and Copper Bonding Paste
Organic Electronic Material and Organic Electronic Element
Organic Electronic Material and Use Thereof
Electronic Component and Method for Manufacturing Electronic Component
Method for Decomposing Flavonoid Glycoside and Method for Producing Flavonoid
Method for Decomposing Flavonoid Glycoside and Method for Producing Flavonoid
Acrylic Resin, Producing Method Thereof, Resin Composition Set, Heat Storage Material, and Article
Resin Composition, Heat Storage Material, and Article
Application:
17/261,571 →
Publication:
US US20210261706A1
Solder Particles and Method for Producing Solder Particles
Application:
17/255,988 →
Publication:
US US20210229222A1
Solder Particles
Anisotropic Conductive Film and Method for Producing the Anisotropic Conductive Film Including a Base Material Having Recesses and Solder Particles Formed Inside the Recesses
Resin Composition, Heat Storage Material, and Article
Application:
17/054,167 →
Publication:
US US20210246349A1
Primer, Substrate Equipped with Primer Layer, Method for Producing Substrate Equipped with Primer Layer, Semiconductor Device, and Method for Producing Semiconductor Device
Application:
17/925,014 →
Publication:
US US20230183415A1
Related Assignments
(20)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Dec 23, 2020
From: AKAI, KUNIHIKO; EJIRI, YOSHINORI; OKADA, YUUHEI; MORIYA, TOSHIMITSU
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 054745/0283 →
Assignment of Assignor's Interest
Dec 23, 2020
From: AKAI, KUNIHIKO; EJIRI, YOSHINORI; OKADA, YUUHEI; MORIYA, TOSHIMITSU
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 054745/0278 →
Assignment of Assignor's Interest
Dec 23, 2020
From: AKAI, KUNIHIKO; EJIRI, YOSHINORI; OKADA, YUUHEI; MORIYA, TOSHIMITSU
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 054745/0273 →
Assignment of Assignor's Interest
Jan 26, 2021
From: ARIFUKU, MOTOHIRO; KURIHARA, YOSHIAKI; KANEEDA, MASATO
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 055025/0231 →
Assignment of Assignor's Interest
Mar 15, 2021
From: ARIFUKU, MOTOHIRO; KURIHARA, YOSHIAKI; KANEEDA, MASATO
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 055585/0391 →
Assignment of Assignor's Interest
Mar 15, 2021
From: FURUKAWA, NAOKI; MORIMOTO, TSUYOSHI; NAGAI, AKIRA; MATSUBARA, NOZOMI
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 055585/0403 →
Assignment of Assignor's Interest
Mar 18, 2021
From: FURUKAWA, NAOKI; MATSUBARA, NOZOMI; MORIMOTO, TSUYOSHI; NAGAI, AKIRA
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 055631/0058 →
Assignment of Assignor's Interest
Mar 29, 2021
From: KAMO, KAZUYUKI; FUKUSHIMA, IORI; SUGIOKA, TOMOTSUGU; ISHITSUKA, KENICHI
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 055745/0187 →
Assignment of Assignor's Interest
Mar 29, 2021
From: KAMO, KAZUYUKI; FUKUSHIMA, IORI; SUGIOKA, TOMOTSUGU; ISHITSUKA, KENICHI
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 055745/0182 →
Assignment of Assignor's Interest
May 21, 2021
From: EJIRI, YOSHINORI; SUKATA, SHINICHIROU; TOBA, MASAYA; NAKAKO, HIDEO
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 056308/0936 →
Assignment of Assignor's Interest
May 23, 2021
From: FURUKAWA, NAOKI; MORIMOTO, TSUYOSHI; SANO, ATSUKO; YOKOTA, HIROSHI
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 056321/0789 →
Assignment of Assignor's Interest
Jun 20, 2021
From: KAWANA, YUKI; NAKAKO, HIDEO; NEGISHI, MOTOHIRO; SUGAMA, CHIE
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 056594/0459 →
Assignment of Assignor's Interest
Jul 13, 2021
From: TAKEZAWA, YOSHITAKA; NOMURA, MASAHIRO
To: SHOWA DENKO MATERIALS CO., LTD.; THE UNIVERSITY OF TOKYO
Reel/Frame 056830/0842 →
Assignment of Assignor's Interest
Oct 6, 2021
From: IZUMI, HIROYUKI; TAKAYASU, SATOSHI; SATO, NAOYOSHI; YOKOKURA, AI
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 057709/0718 →
Assignment of Assignor's Interest
Oct 15, 2021
From: FURUKAWA, NAOKI; MORIMOTO, TSUYOSHI; SANO, ATSUKO; YOKOTA, HIROSHI
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 057800/0827 →
Assignment of Assignor's Interest
Dec 23, 2021
From: INOUE, HIDETOSHI; ONO, YUTA; ENDO, YOSHINORI
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 058475/0385 →
Assignment of Assignor's Interest
Mar 14, 2022
From: KANG, DONGCHUL; OKUBO, SEIGO
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 059249/0745 →
Assignment of Assignor's Interest
Jul 8, 2022
From: YAMAURA, MASASHI; ARATA, MICHITOSHI; NAKAYAMA, AYUMI; KONDO, YUSUKE
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 060466/0766 →
Assignment of Assignor's Interest
Dec 5, 2022
From: TANG, NING; TANAKA, SHINGO; TAKEZAWA, YOSHITAKA
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 061965/0520 →
Change of Address
Feb 9, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066547/0677 →