IP Library Patent Application 17261571
Patent Application
App. No. 17/261,571

RESIN COMPOSITION, HEAT STORAGE MATERIAL, AND ARTICLE

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Quick Facts
Patent No.
US None
App. No.
17/261,571
Abstract

An aspect of the present invention provides a resin composition containing an acrylic resin which is obtained by polymerizing a monomer component including: a first monomer represented by formula (1); and a second monomer which is copolymerizable with the first monomer and has a block isocyanate group. (In the formula, R 1 represents a hydrogen atom or a methyl group, and R 2 represents an alkyl group having 12-30 carbon atoms.)

Claims (17)

1 . A resin composition comprising an acrylic resin obtained by polymerizing a monomer component including a first monomer represented by the following Formula (1) and a second monomer copolymerizable with the first monomer and having a block isocyanate group:

[in the formula, R 1 represents a hydrogen atom or a methyl group and R 2 represents an alkyl group having 12 to 30 carbon atoms].

2 . A resin composition comprising an acrylic resin including a first structural unit represented by the following Formula (2) and a second structural unit having a block isocyanate group:

[in the formula, R 3 represents a hydrogen atom or a methyl group, and R 4 represents an alkyl group having 12 to 30 carbon atoms].

3 . The resin composition according to claim 1 , further comprising

a curing agent capable of reacting with the block isocyanate group under deprotection conditions of the block isocyanate group.

4 . The resin composition according to claim 3 , wherein the curing agent is at least one compound selected from the group consisting of an amine compound and an alcohol compound.

5 . The resin composition according to claim 1 , wherein a content of the first monomer is 60 parts by mass or more with respect to 100 parts by mass of the monomer components.

6 . The resin composition according to claim 1 , wherein a content of the second monomer is 25 parts by mass or less with respect to 100 parts by mass of the monomer components.

7 . The resin composition according to claim 2 , wherein a content of the first structural unit is 60 parts by mass or more with respect to 100 parts by mass of all structural units constituting the acrylic resin.

8 . The resin composition according to claim 2 , wherein a content of the second structural unit is 25 parts by mass or less with respect to 100 parts by mass of all structural units constituting the acrylic resin.

9 . The resin composition according to claim 1 , wherein a content of the acrylic resin is 50 parts by mass or more with respect to 100 parts by mass of the resin composition.

10 . The resin composition according to claim 1 , wherein the resin composition is used to form a heat storage material.

11 . A heat storage material including a cured product of the resin composition according to claim 1 .

12 . An article, comprising:

a heat source; and

a cured product of the resin composition according to claim 1 , the cured product provided to be in thermal contact with the heat source.

Assignments (3)
CHANGE OF ADDRESS Recorded Feb 9, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066547/0677 →
CHANGE OF NAME Recorded Apr 23, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 063410/0085 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 15, 2021
From: FURUKAWA, NAOKI; MORIMOTO, TSUYOSHI; NAGAI, AKIRA; MATSUBARA, NOZOMI
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 055585/0403 →