Patent Assignment
Reel/Frame 056594/0459
Assignment of Assignor's Interest
Recorded: 2021-06-20
Pages: 4
Assignors
KAWANA, YUKI
Executed: 2021-06-05
NAKAKO, HIDEO
Executed: 2021-05-27
NEGISHI, MOTOHIRO
Executed: 2021-05-31
SUGAMA, CHIE
Executed: 2021-05-27
EJIRI, YOSHINORI
Executed: 2021-05-31
YANAKA, YUICHI
Executed: 2021-06-01
Assignee
SHOWA DENKO MATERIALS CO., LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU,, TOKYO, 100-6606, JAPAN
Covered Property
(1)
Method for Producing Bonded Object and Semiconductor Device and Copper Bonding Paste
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.