Patent Assignment
Reel/Frame 056830/0842
Assignment of Assignor's Interest
Recorded: 2021-07-13
Pages: 4
Assignees
SHOWA DENKO MATERIALS CO., LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU,, TOKYO, 100-6606, JAPAN
THE UNIVERSITY OF TOKYO
3-1, HONGO 7-CHOME, BUNKYO-KU,, TOKYO, 113-8654, JAPAN
Covered Property
(1)
Anisotropic Heat-Conducting Resin Member and Heat-Transmitting Substrate
Application:
17/422,440 →
Publication:
US 2022/0089930
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.