IP Library › Assignment 060466/0766
Patent Assignment
Reel/Frame 060466/0766

Assignment of Assignor's Interest

Recorded: 2022-07-08 Pages: 5
Assignors
YAMAURA, MASASHI
Executed: 2022-06-16
ARATA, MICHITOSHI
Executed: 2022-06-20
NAKAYAMA, AYUMI
Executed: 2022-06-16
KONDO, YUSUKE
Executed: 2022-06-16
NOGUCHI, YUJI
Executed: 2022-06-16
Assignee
SHOWA DENKO MATERIALS CO., LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU,, TOKYO, 100-6606, JAPAN
Covered Property (1)
Resin Composition for Molding and Electronic Component Apparatus
Application: 17/791,534 →
Publication: US 2023/0092703
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Apr 23, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 063410/0085 →
Change of Address Feb 9, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066547/0677 →