RESIN COMPOSITION FOR MOLDING AND ELECTRONIC COMPONENT APPARATUS
A resin composition for molding includes an epoxy resin, a curing agent, and an inorganic filler containing at least one selected from the group consisting of calcium titanate particles and strontium titanate particles, in which a total content of the calcium titanate particles and the strontium titanate particles is 30% by volume or more and less than 60% by volume with respect to the entire inorganic filler.
1 . A resin composition for molding, which is used in sealing of an electronic component in a high frequency device, comprising:
an epoxy resin;
a curing agent; and
an inorganic filler containing calcium titanate particles,
wherein a content of the calcium titanate particles is 30% by volume or more and less than 60% by volume with respect to the entire inorganic filler, and a total content of the calcium titanate particles and strontium titanate particles is 30% by volume or more and less than 60% by volume with respect to the entire inorganic filler, and
the inorganic filler further contains at least one selected from the group consisting of silica particles and alumina particles.
2 . The resin composition for molding according to claim 1 , wherein the curing agent includes an active ester compound.
3 . (canceled)
4 . The resin composition for molding according to claim 1 ,
wherein the inorganic filler contains alumina particles.
5 . The resin composition for molding according to claim 1 ,
wherein a relative dielectric constant of the entire inorganic filler at 10 GHz is 80 or less.
6 . The resin composition for molding according to claim 1 ,
wherein a total content of the inorganic filler is 40% by volume to 85% by volume with respect to the entire resin composition for molding.
7 . (canceled)
8 . The resin composition for molding according to claim 1 , which is used in an antenna-in-package.
9 . An electronic component apparatus comprising:
a support member;
an electronic component placed on the support member; and
a cured product of the resin composition for molding according to claim 1 which seals the electronic component.
10 . The electronic component apparatus according to claim 9 , wherein the electronic component includes an antenna.
11 . A resin composition for molding comprising:
an epoxy resin;
a curing agent; and
an inorganic filler containing calcium titanate particles, and a total content of the calcium titanate particles and strontium titanate particles is 30% by volume or more and less than 60% by volume with respect to the entire inorganic filler, wherein
the inorganic filler further contains at least one selected from the group consisting of silica particles and alumina particles, and
a total content of the inorganic filler is 40% by volume to 85% by volume with respect to the entire resin composition for molding.
12 . The resin composition for molding according to claim 11 , which is used in a high frequency device.
13 . The resin composition for molding according to claim 11 ,
wherein the curing agent includes an active ester compound.
14 . The resin composition for molding according to claim 11 ,
wherein the inorganic filler contains alumina particles.
15 . The resin composition for molding according to claim 11 ,
wherein a relative dielectric constant of the entire inorganic filler at 10 GHz is 80 or less.
16 . The resin composition for molding according to claim 11 , which is used in an antenna-in-package.
17 . An electronic component apparatus comprising:
a support member;
an electronic component placed on the support member; and
a cured product of the resin composition for molding according to claim 11 which seals the electronic component.
18 . The electronic component apparatus according to claim 17 ,
wherein the electronic component includes an antenna.
19 . A resin composition for molding comprising:
an epoxy resin;
a curing agent, including an active ester compound; and
an inorganic filler containing at least one selected from the group consisting of calcium titanate particles and strontium titanate particles,
wherein a total content of the calcium titanate particles and the strontium titanate particles is 30% by volume or more and less than 60% by volume with respect to the entire inorganic filler.
20 . The resin composition for molding according to claim 19 ,
wherein the inorganic filler further contains at least one selected from the group consisting of silica particles and alumina particles.
21 . The resin composition for molding according to claim 19 ,
wherein a total content of the inorganic filler is 40% by volume to 85% by volume with respect to the entire resin composition for molding.
22 . The resin composition for molding according to claim 19 , which is used in a high frequency device.
23 . The resin composition for molding according to claim 19 ,
wherein the inorganic filler contains alumina particles.
24 . The resin composition for molding according to claim 19 ,
wherein a relative dielectric constant of the entire inorganic filler at 10 GHz is 80 or less.
25 . The resin composition for molding according to claim 19 , which is used in an antenna-in-package.
26 . An electronic component apparatus comprising:
a support member;
an electronic component placed on the support member; and
a cured product of the resin composition for molding according to claim 19 which seals the electronic component.
27 . The electronic component apparatus according to claim 26 ,
wherein the electronic component includes an antenna.