Patent Assignment
Reel/Frame 059249/0745
Assignment of Assignor's Interest
Recorded: 2022-03-14
Pages: 3
Assignee
SHOWA DENKO MATERIALS CO., LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU,, TOKYO, 100-6606, JAPAN
Covered Property
(1)
Encapsulating Material for Compression Molding and Electronic Part Device
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.