IP Library Granted Patent US 11,965,048
Granted Patent B2
US 11,965,048 · App. 17/261,877 · Granted Apr 23, 2024

Acrylic resin, producing method thereof, resin composition set, heat storage material, and article

Inventors: Naoki Furukawa (Tokyo, JP); Nozomi Matsubara (Tokyo, JP); Tsuyoshi Morimoto (Tokyo, JP); Akira Nagai (Tokyo, JP)
Assignee: RESONAC CORPORATION
C08F290/126C08F220/1804C08F220/1812C08F220/1818C08F220/20C08F220/36C08K5/14C09K5/063
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Quick Facts
Patent No.
US 11,965,048
App. No.
17/261,877
Granted
Apr 23, 2024
Kind
B2
Abstract

An aspect according to the present invention provides an acrylic resin including a first structural unit represented by formula (1) and a second structural unit represented by formula (2): [in the formula (1), R 1 represents a hydrogen atom or a methyl group, and R 2 represents an alkyl group having 12-30 carbon atoms] [in the formula (2), R 3 and R 5 each independently represent a hydrogen atom or a methyl group, and R 4 represents a divalent organic group].

Claims (12)

1. A heat storage material-lining a cured product of a mixture containing a first liquid and a second liquid in a resin composition set, wherein the resin composition set comprises:

the first liquid containing an oxidizing agent and the second liquid containing a reducing agent,

wherein at least one of the first liquid and the second liquid contains an acrylic resin, the acrylic resin contains a first structural unit represented by the following Formula (1) and a second structural unit represented by the following Formula (2):

[in the formula, R 1 represents a hydrogen atom or a methyl group and R 2 represents an alkyl group having 12 to 30 carbon atoms]

[in the formula, R 3 and R 5 each independently represent a hydrogen atom or a methyl group, and R 4 represents a group represented by the following Formulae (5) or (8)]

[in the formula, R 10 , R 11 , R 16 and R 17 each independently represent a divalent hydrocarbon group, and * represents a bond].

2. The heat storage material according to claim 1 , wherein the alkyl group represented by R 2 is a tetradecyl group, a hexadecyl group, an octadecyl group, a docosyl group, a tetracosyl group, a hexacosyl group, or an octacosyl group.

3. The heat storage material according to claim 1 , wherein a content of the first structural unit is 70 parts by mass or more and 98 parts by mass or less, with respect to 100 parts by mass of all structural units constituting the acrylic resin.

4. The heat storage material according to claim 3 , wherein a content of the second structural unit is 2 parts by mass or more and 20 parts by mass or less, with respect to 100 parts by mass of all structural units constituting the acrylic resin.

5. An article, comprising:

a heat source; and

the heat storage material according to claim 1 that is provided so that the heat storage material is in thermal contact with the heat source.

Assignments (3)
CHANGE OF ADDRESS Recorded Feb 9, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066547/0677 →
CHANGE OF NAME Recorded Apr 23, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 063410/0085 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 18, 2021
From: FURUKAWA, NAOKI; MATSUBARA, NOZOMI; MORIMOTO, TSUYOSHI; NAGAI, AKIRA
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 055631/0058 →
Priority Claims (1)
JP 2018-139571 · Jul 25, 2018 · national
Continuity (1)
Related Publication 20210301059A1 · Sep 30, 2021