IP Library Assignment 058475/0385
Patent Assignment
Reel/Frame 058475/0385

Assignment of Assignor's Interest

Recorded: 2021-12-23 Pages: 3
Assignors
INOUE, HIDETOSHI
Executed: 2021-12-03
ONO, YUTA
Executed: 2021-11-29
ENDO, YOSHINORI
Executed: 2021-11-29
Assignee
SHOWA DENKO MATERIALS CO., LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU,, TOKYO, 100-6606, JAPAN
Covered Property (1)
Compound, Molded Article, and Cured Product
Application: 17/613,493 →
Publication: US 2022/0243034
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Apr 23, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 063410/0085 →
Change of Address Feb 9, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066547/0677 →