IP Library › Granted Patent US 12,721,203
Granted Patent B2
US 12,721,203 · App. 18/263,712 · Granted Aug 25, 2026

Solder paste, method for forming solder bumps, and method for manufacturing member provided with solder bumps

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Quick Facts
Patent No.
US 12,721,203
App. No.
18/263,712
Granted
Aug 25, 2026
Kind
B2
Assignments (2)
CHANGE OF ADDRESS Recorded Feb 9, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066547/0677 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 31, 2023
From: EJIRI, YOSHINORI; SUKATA, SHINICHIROU; AKAI, KUNIHIKO; SAKAMOTO, MASUMI; SHIMIZU, CHIAKI; KAKEHATA, JUNICHI; YOSHIBA, AYUMI
To: RESONAC CORPORATION
Reel/Frame 064759/0793 →
Continuity (1)
Related Publication 20240297135A1 · Sep 5, 2024
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