Assignment of Assignor's Interest

Recorded: 2023-08-31 Pages: 4

Assignors

EJIRI, YOSHINORI

Executed: 2023-08-22

SUKATA, SHINICHIROU

Executed: 2023-08-22

AKAI, KUNIHIKO

Executed: 2023-08-22

SAKAMOTO, MASUMI

Executed: 2023-08-22

SHIMIZU, CHIAKI

Executed: 2023-08-22

KAKEHATA, JUNICHI

Executed: 2023-08-22

YOSHIBA, AYUMI

Executed: 2023-08-22

Assignee

RESONAC CORPORATION

13-9, SHIBA DAIMON 1-CHOME, MINATO-KU, TOKYO, 105-8518, JAPAN

Covered Property (1)

Solder Paste, Method for Forming Solder Bumps, and Method for Manufacturing Member Provided with Solder Bumps

Application: 18/263,712 →

Publication: US 2024/0297135

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.