IP Library Granted Patent US 12,215,439
Granted Patent B2
US 12,215,439 · App. 18/523,840 · Granted Feb 4, 2025

SiC epitaxial wafer

Inventors: Hiromasa Suo (Tokyo, JP); Rimpei Kindaichi (Tokyo, JP); Tamotsu Yamashita (Tokyo, JP)
Assignee: Resonac Corporation
C30B29/36
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 12,215,439
App. No.
18/523,840
Granted
Feb 4, 2025
Kind
B2
Abstract

A SiC epitaxial wafer including: a SiC substrate; and a SiC epitaxial layer stacked on one surface of the SiC substrate, wherein a diameter of the SiC substrate is 195 mm or more, and a warp is 50 μm or less.

Claims (13)

1. A SiC epitaxial wafer comprising:

a SiC substrate; and

a SiC epitaxial layer stacked on one surface of the SiC substrate, wherein,

a diameter of the SiC substrate is 195 mm or more, and

a warp is 50 μm or less.

2. The SiC epitaxial wafer according to claim 1 ,

wherein, in a surface of the SiC epitaxial layer, in a case where supports are positioned to overlap with a circumference on 7.5 mm inside from an outermost periphery and a plane passing through parts overlapping with the supports when seen in a thickness direction is defined as a reference plane, a bow is 30 μm or less.

3. The SiC epitaxial wafer according to claim 1 ,

wherein, the warp is 30 μm or less.

4. The SiC epitaxial wafer according to claim 2 ,

wherein, the bow is 10 μm or less.

5. The SiC epitaxial wafer according to claim 2 ,

wherein, the bow is-30 μm or more.

Assignments (1)
CHANGE OF ADDRESS Recorded Feb 9, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066547/0677 →
Cited By (1)
US 12,540,419